Apparatus including arrays of pick-up heads and bonding heads and a method of using the same
BJ Choi - US Patent 12,131,926, 2024 - Google Patents
An apparatus can include a source chuck, an array of pick-up heads, an array of bonding
heads, and a product chuck. The source chuck can have a source holding surface facing a …
heads, and a product chuck. The source chuck can have a source holding surface facing a …