High density interconnection printed circuit board PCB puts forward high requirements for
defect free blind holes copper filling. Here, 5-amino-1, 3, 4-thiadiazole-2-mercaptan, a small …

Recently, quaternary ammonium salt is considered as an effective leveler because of its
easy adsorption on the cathode surface. However, quaternary ammonium salt compounds …

An organic additive, Diazine Black (DB), was employed as a leveler for microvia filling using
copper electroplating. DB is a derivative of Janus Green B (JGB), which is a common leveler …

In this work, the leveling effect of two typical levelers for copper electroplating, Janus Green
B (JGB) and polymerizates of imidazole and epichlorohydrin (IMEP) are both analyzed …

Electronic parameters of four additives for copper electroplating including accelerators,
mercaptopropane sulfonic acid (MPS) and bis-(acid-sulfopropyl)-disulfide (SPS), inhibitor …

In order to achieve a perfect bottom-up electroplated Cu filling with a minimal surface
thickness, 2-mercaptopyridine (2-MP) was investigated as a new leveler for replacing Janus …

In this work, a novel, simple, and green citrate-based copper electronic electroplating bath
with the characteristics of weak corrosion, low copper ion concentration, and simple …

Six dye levelers are researched by quantum chemical calculations and molecular dynamics
simulations. The electrostatic potential (ESP) and Hirshfeld charge of the levelers were …

In this paper, single-crystalline TiO 2 nanosheet (TNS) arrays with dominant {001} facets
decorated with Ag nanoparticles were synthesized on fluorine-doped tin oxide (FTO) …

We synthesize new triethylene glycol-based levelers containing quaternary ammonium
groups with different terminal functional groups (allyl, propyl, benzyl, and naphthylmethyl) to …