Electronics packaging design is a process that requires optimized solutions based on
multidisciplinary design trade-offs, which usually have complex relationships among …

Purpose–This paper aims to present an integrated optimisation‐modelling computational
approach for virtual prototyping that helps design engineers to improve the reliability and …

As the electronic packaging industry develops technologies for fabrication of smaller, faster,
economical and reliable products, thermal management and design play an important role …

PoP is a potential solution to high-speed memory packaging. For PoP package, warpage is
known as a concern over package stacking and SMT yield [1]. The PoP package under …

The current paper talks about warpage modeling and validation, DOE analysis and
approximation model derivation, and solving of actual warpage problem. Warpage of actual …

Purpose–The purpose of this paper is to evaluate the application of an acoustic micro‐
imaging (AMI) inspection technique in monitoring solder joints through lifetime performance …

As the Electronic Packaging industry develops technologies for fabrication of smaller, faster,
economical and reliable products; thermal management and design play an important role …

Reliability of electronic parts is a major concern for many manufacturers, since early failures
in the field can cost an enormous amount to repair-in many cases far more than the original …

This paper presents the assembly process using next generation electroformed stencils and
Isotropic Conductive Adhesives (ICAs) as interconnection material. The utilisation of ICAs in …

Packaging technology used in liquid crystal displays (LCDs) faces the critical issues such as
high density interconnects, thinner packaging size, and environmental safety. In order to …