Advanced mechanical/optical configuration of real-time moire interferometry for thermal deformation analysis of fan-out wafer level package
The mechanical/optical configuration of moiré interferometry for real-time observation of
thermal deformations is advanced to quantify the thermomechanical behavior of fan-out …
thermal deformations is advanced to quantify the thermomechanical behavior of fan-out …
Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation
The anisotropic coefficient of thermal expansions (CTEs) of SAC305 grain are measured
using a full-field in-plane displacement measurement technique. Theoretical relationships …
using a full-field in-plane displacement measurement technique. Theoretical relationships …
Advancement of Moiré Interferometry for Rate-Dependent Material Behavior and Micromechanical Deformations
B Wu - 2018 - search.proquest.com
Moiré interferometry is an optical technique to map full field in-plane deformations with
extremely high resolution and signal to noise ratio. The technique is advanced and …
extremely high resolution and signal to noise ratio. The technique is advanced and …
Effects of Underfill on Thermo-Mechanical Behavior of Fan-out Wafer Level Package Used in PoP: An Experimental Study by Advancements of Real-time Moiré …
Thermo-mechanical behavior of a FO-WLP used in a Package-on-Package (PoP) without
and with reworkable underfill is investigated by an advanced moiré interferometry system for …
and with reworkable underfill is investigated by an advanced moiré interferometry system for …