Techniques for an inductor at a second level interface
C Xu, Y Deng, KO Lee, JY Park… - US Patent …, 2020 - Google Patents
Techniques are provided for an inductor at a second level interface between a first substrate
and a second substrate. In an example, the inductor can include a winding and a core …
and a second substrate. In an example, the inductor can include a winding and a core …
Magnetic inductor structures for package devices
P Chatterjee, J Zhao, S Vadlamani, Y Wang… - US Patent App. 17 …, 2022 - Google Patents
Methods/structures of forming in-package inductor structures are described. Embodiments
include a substrate including a dielectric material, the substrate having a first side and a …
include a substrate including a dielectric material, the substrate having a first side and a …
Magnetic core using composite material
MJ Lee, IH Jeon, SW Lee, S Bae - US Patent 12,112,876, 2024 - Google Patents
The present invention relates to a magnetic core using a different type of magnetic material.
The magnetic core according to one embodiment may comprise: a ferrite powder comprising …
The magnetic core according to one embodiment may comprise: a ferrite powder comprising …
Techniques for an inductor at a second level interface
C Xu, Y Deng, KO Lee, JY Park… - US Patent …, 2021 - Google Patents
Techniques are provided for an inductor at a second level interface between a first substrate
and a second substrate. In an example, the inductor can include a winding and a core …
and a second substrate. In an example, the inductor can include a winding and a core …
Apparatus and system of a printed circuit board (PCB) including a radio frequency (RF) transition
O Markish, S Dalmia, A Amadjikpe - US Patent 11,596,055, 2023 - Google Patents
US11596055B2 - Apparatus and system of a printed circuit board (PCB) including a radio
frequency (RF) transition - Google Patents US11596055B2 - Apparatus and system of a printed …
frequency (RF) transition - Google Patents US11596055B2 - Apparatus and system of a printed …