Review of nanosheet metrology opportunities for technology readiness

MA Breton, D Schmidt, A Greene… - Journal of Micro …, 2022 - spiedigitallibrary.org
Over the past several years, stacked nanosheet gate-all-around (GAA) transistors captured
the focus of the semiconductor industry and have been identified as the lead architecture to …

Extracting dimensional parameters of gratings produced with self-aligned multiple patterning using grazing-incidence small-angle x-ray scattering

M Pflüger, RJ Kline, AF Herrero… - Journal of Micro …, 2020 - spiedigitallibrary.org
Background: To ensure consistent and high-quality semiconductor production at future logic
nodes, additional metrology tools are needed. For this purpose, grazing-incidence small …

Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?

K Lai, CC Liu, H Tsai, Y Xu, C Chi… - Journal of Micro …, 2017 - spiedigitallibrary.org
We report a systematic study of the feasibility of using directed self-assembly (DSA) in real
product design for 7-nm fin field effect transistor (FinFET) technology. We illustrate a design …

Bayesian dropout approximation in deep learning neural networks: analysis of self-aligned quadruple patterning

SD Halle, DN Dunn, AH Gabor… - Journal of Micro …, 2022 - spiedigitallibrary.org
Background Predictive estimates of the final process outcome (s) of multistep, coupled
processes can be difficult to make based on data measured at the various process steps …

AFM characterization for gate-all-around (GAA) devices

M Breton, J Fullam, D Kong, D Schmidt… - … Process Control for …, 2020 - spiedigitallibrary.org
As development of stacked Nanosheet Gate All-Around (GAA) transistor continues as the
candidate technology for future nodes, several key process points remain difficult to …

Substrate, metrology apparatus and associated methods for a lithographic process

A Verma, HAJ Cramer, T Theeuwes… - US Patent …, 2020 - Google Patents
A substrate having a plurality of features for use in measuring a parameter of a device
manufacturing process and associated methods and apparatus. The measurement is by …

[PDF][PDF] Extracting Dimensional Parameters of Gratings Produced with Self-Aligned Multiple Patterning Using GISAXS

M Pflüger12, RJ Kline, AF Herrero… - arXiv preprint arXiv …, 2019 - tsapps.nist.gov
Background: To ensure consistent and high-quality semiconductor production at future logic
nodes, additional metrology tools are needed. For this purpose, grazing-incidence small …

[PDF][PDF] Experiment Management Wafer and Wafer Group Graph

TD Carvalho - 2020 - repositorio-aberto.up.pt
In the 21st century, Industry 4.0 emerged as a promising approach to face global
competition. However, its requirements demand profound changes in manufacturing …

Process Optimization by Clamped Monte Carlo Distribution

S Halle, D Derren, N Felix, D Gupta - US Patent App. 16/539,809, 2021 - Google Patents
Techniques for semiconductor process flow disposition opti mization using clamped Monte
Carlo distribution are pro vided. In one aspect, a method for optimizing a semicon ductor …

Substrate, metrology apparatus and associated methods for a lithographic process

A Verma, HAJ Cramer, T Theeuwes… - US Patent …, 2020 - Google Patents
(57) ABSTRACT A substrate having a plurality of features for use in measur ing a parameter
of a device manufacturing process and associated methods and apparatus. The …