Modeling thermoelectric effects in piezoelectric semiconductors: new fully coupled mechanisms for mechanically manipulated heat flux and refrigeration

Y Qu, E Pan, F Zhu, F Jin, AK Roy - International Journal of Engineering …, 2023 - Elsevier
We present a continuum theory for analyzing the interaction between the thermoelectric and
mechanical fields in piezoelectric semiconductors. The balance laws and dissipation …

Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method

M Jafari - European Journal of Mechanics-A/Solids, 2019 - Elsevier
One of the most important issues in the design of engineering structures is the prevention of
structural failure due to the stress caused by geometric discontinuities. Hole geometry is one …

[HTML][HTML] Analysis of inclusion in thermoelectric materials: The thermal stress field and the effect of inclusion on thermoelectric properties

P Wang, BL Wang, KF Wang, YJ Cui - Composites Part B: Engineering, 2019 - Elsevier
This paper analyses a two-dimensional problem in thermoelectric materials with an inclined
elliptic inclusion. We have obtained the closed-form solutions of electric current density and …

Modeling of thermoelectric generators with effects of side surface heat convection and temperature dependence of material properties

P Wang, KF Wang, BL Wang, YJ Cui - … Journal of Heat and Mass Transfer, 2019 - Elsevier
This paper develops a general model to analyze the performance of thermoelectric
generators (TEGs) with consideration of their side surface heat convection (SSHC) and …

Role of crack length, crack spacing and layer thickness ratio in the electric potential and temperature of thermoelectric bi-materials systems

D Jiang, YT Zhou - Engineering Fracture Mechanics, 2022 - Elsevier
The influence of dual collinear interface cracks on the electric potential and temperature of
thermoelectric bi-materials system under the electric load and thermal load is reported. The …

Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids

P Wang, BL Wang, KF Wang, H Hirakata… - International Journal of …, 2019 - Elsevier
Thermoelectric (TE) materials as energy functional semiconductors can directly convert heat
into electrical power. Due to the brittle nature of semiconductors, voids or inclusions are …

Electric-current-induced thermal stress around a non-circular rigid inclusion in a two-dimensional nonlinear thermoelectric material

HB Yang, CB Yu, JY Tang, J Qiu, XQ Zhang - Acta Mechanica, 2020 - Springer
The plane problem of a non-circular rigid inhomogeneity embedded in an infinite
thermoelectric matrix under a uniform remote electric current is investigated based on the …

The effectiveness of the bonding layer to attain reliable thermoelectric structures

XJ Tian, YT Zhou, SH Ding - European Journal of Mechanics-A/Solids, 2022 - Elsevier
The reliable interface plays a significant role in improving the performance of thermoelectric
devices. Due to the interface stability, thermoelectric interfacial layers are prone to multilayer …

Lifetime prediction of thermoelectric devices under thermal cycling

P Wang, JE Li, BL Wang, T Shimada, H Hirakata… - Journal of Power …, 2019 - Elsevier
Thermoelectric (TE) devices under thermal cycling are prone to interface defects. Based on
the experimental observation, this paper proposes a generalized model to analyze the …

A general analytical approach to the thermoelastic analysis of asymmetric anisotropic nanoplate with polygonal holes

V Zeighami, M Jafari, H Altenbach - Continuum Mechanics and …, 2024 - Springer
The structural complexity of high-tech industries is often compromised by a combination of
thermal, mechanical, and geometric weaknesses. New generation materials and …