[HTML][HTML] Carburization-induced microstructure evolution and hardening mechanism of 18CrNiMo7-6 steel
G Wang, X Sang, Y Zhang, MH Zhao, GT Xu… - Journal of Materials …, 2023 - Elsevier
The microstructural evolution and hardening mechanism caused by carburizing heat
treatment must be determined to improve the in-service functional performance of …
treatment must be determined to improve the in-service functional performance of …
Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil
Y Xiao, W Sun, Z Bai, E Liu, L Du, H Cai… - Journal of Applied …, 2023 - Springer
Additives are a cost-effective method to improve the performance of the very low profile
(HVLP) copper foil coarsened layer. In this paper, the effects of 3, 3'-Dithiobis-1 …
(HVLP) copper foil coarsened layer. In this paper, the effects of 3, 3'-Dithiobis-1 …
Functional additives inhibit crystal growth to achieve low-roughness and high-peel strength of micro-coarsening copper foil
L Li, X Peng, J Jiang, R Li, J Zhang, P Yang, M An - Ionics, 2024 - Springer
With the global proliferation of 5G technology, advancing electronic interconnection
technologies has become critically important. The development of high-quality electrolytic …
technologies has become critically important. The development of high-quality electrolytic …
Softened microstructure and properties of 12 μm thick rolled copper foil
R Feng, W Zhao, Y Sun, X Wang, B Gong, B Chang… - Materials, 2022 - mdpi.com
Up to now, 12 μm thick rolled copper foil is the thinnest rolled copper foil that can be stably
produced. The softened microstructure and properties of 12 μm thick rolled copper foil were …
produced. The softened microstructure and properties of 12 μm thick rolled copper foil were …
[HTML][HTML] Effects of deformation and applied temperature on the microstructure and performance of industrial ultra-thin rolled Cu foil
Z Dong, X Fei, L Feng, J Nie, W Li, B Gong - Journal of Materials Research …, 2023 - Elsevier
Five-generation communication, foldable cell phone, and wearable devices promote the
development of Cu foils by applying multi-layer printed circuit board (MLPCB) and flexible …
development of Cu foils by applying multi-layer printed circuit board (MLPCB) and flexible …
[HTML][HTML] Microstructural response of copper foil to a novel double-cross rolling process
J Li, X Ren, Y Zhang, H Hou, Q Yan - Journal of Materials Research and …, 2020 - Elsevier
Bending resistance is regarded as a significant factor in achieving the widespread
application of copper foils. This paper proposed a novel double-cross rolling process, which …
application of copper foils. This paper proposed a novel double-cross rolling process, which …
Effects of Cold Rolling Path on Recrystallization Behavior and Mechanical Properties of Pure Copper During Annealing
J Chen, H Liu, W Xu, Z Li, X Shen, G Lin - Available at SSRN 4755884 - papers.ssrn.com
This study investigated the recrystallization behavior, grain boundary characteristics and
distributions, and mechanical properties of pure Cu foils subjected to cold rolling parallel …
distributions, and mechanical properties of pure Cu foils subjected to cold rolling parallel …