The microstructural evolution and hardening mechanism caused by carburizing heat
treatment must be determined to improve the in-service functional performance of …

Additives are a cost-effective method to improve the performance of the very low profile
(HVLP) copper foil coarsened layer. In this paper, the effects of 3, 3'-Dithiobis-1 …

With the global proliferation of 5G technology, advancing electronic interconnection
technologies has become critically important. The development of high-quality electrolytic …

Up to now, 12 μm thick rolled copper foil is the thinnest rolled copper foil that can be stably
produced. The softened microstructure and properties of 12 μm thick rolled copper foil were …

Five-generation communication, foldable cell phone, and wearable devices promote the
development of Cu foils by applying multi-layer printed circuit board (MLPCB) and flexible …

Bending resistance is regarded as a significant factor in achieving the widespread
application of copper foils. This paper proposed a novel double-cross rolling process, which …

This study investigated the recrystallization behavior, grain boundary characteristics and
distributions, and mechanical properties of pure Cu foils subjected to cold rolling parallel …