This paper reviews the possible causes and effects for no-fault-found observations and
intermittent failures in electronic products and summarizes them into cause and effect …

Copper wire bonding has been studied for more than two decades. While copper wire
bonding has many advantages over gold wire bonding, many challenges have to be solved …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Copper wire bonding has gained popularity due to its economic advantage and superior
electrical performance. However, copper is harder than gold, and replacing gold wire with …

Reliable bonding of thick Al wires and plated Au pad is important for the packaging of power
modules. The interfacial phases of the Al/Au/Cu joint after parallel gap micro-resistance …

Interfacial reactions are important in microelectronic devices and can be accelerated or
decelerated by imposing a direct electric current normal to the interface. These effects are …

Ultrasonic energy is widely used in wire bonding for microelectronics packaging. It is
necessary to ensure that the maximum ultrasonic vibration displacement occurs at or near …

We prove that we can, using contact resistance as a tool, determine the instant when the
bonding process starts, ie microwelds start to form during ultrasonic bonding. This …

Dans le domaine des applications avioniques, des dispositifs d'électronique de puissance
sont susceptible d'être placés sur le réacteur avec, dans le pire des cas, une température …

Page 1 EGEM Génie électrique Diagnostic des machines électriques sous la direction de
Jean-Claude Trigeassou #ºnse Lavoisier Page 2 Page 3 Diagnostic des machines …