The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

Immersion cooling is highly efficient thermal management technique and can potentially be
used for thermal management of high-density data. However, to use this as a viable cooling …

In this study, time-temperature-dependent nonlinear analyses of lead-free solder bumped
wafer level chip scale package (WLCSP) on microvia buildup printed circuit board (PCB) …

Various studies have been conducted to study the effect of varying board thickness on
thermo-mechanical reliability of BGA packages. Wafer level chip scale packages (WLCSP) …

During the design and manufacturing processes of electronic packaging, solder joints are
fabricated using a variety of methods to provide both mechanical and electrical connections …

Miniaturisation of SnAgCu solder joints for electronic package results in the diminishment of
the number of grains within a single joint, sometimes down to only one or two grains per …

The adhesion of plated metal layers to polymer surfaces is of prime importance for the
reliability of interconnections in electronics. An increase in the roughness of the polymer …

To analyze the effects of nonlinear behavior characteristics of prepreg (PPG) among the
insulating materials of substrate and the residual stress of laminating process on the …

In this chapter, advanced packaging is defined. The kinds of advanced packaging are
ranked based on their interconnect density and electrical performance, and are grouped into …

Flip–chip substrates have been developed to meet the recent technical trend. They have a
small IVH (Inner Via Hole) diameter to improve electrical packaging performance. However …