In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are
presented in this study. Emphasis is placed on:(A) the package formations such as (a) chip …

First of all, semiconductor technology is out of the scope of this book and semiconductor
advanced packaging technology is the focus. In this chapter, the advanced packaging will …

In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC …

The system-in-package (SiP) has gained much interest in the current rapid development of
integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This …

In this study, we designed and electroplated various regular and nanotwinned copper (nt-
Cu) lines. These Cu lines were then covered with a polyimide (PI) layer and heat-treated to …

In this article, the fan-out chip-last panel-level packaging for heterogeneous integration is
investigated. Emphasis is placed on the design, materials, process, fabrication, and …

To meet the requirements of low cost, thin vehicles, and multiple functions, the fan-out panel-
level packaging (FO-PLP) is introduced to be one of the next-generation packaging …

Requirements for the miniaturization of electronics are constantly increasing as more and
more functions are aimed to be integrated into a single device. At the same time, there are …

Several design parameters affect the reliability of wafer-level type advanced packaging,
such as upper and lower pad sizes, solder volume, buffer layer thickness, and chip …