Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

G Ren, IJ Wilding, MN Collins - Journal of Alloys and Compounds, 2016 - Elsevier
Due to its commercial potential and the technological challenges associated with
processing, low temperature soldering is a topic gaining widespread interest in both industry …

Improved predictions of lead free solder joint reliability that include aging effects

M Motalab, Z Cai, JC Suhling, J Zhang… - 2012 IEEE 62nd …, 2012 - ieeexplore.ieee.org
It has been demonstrated that isothermal aging leads to large reductions (up to 50%) in
several key material properties for lead free solders including stiffness (modulus), yield …

Determination of Anand constants for SAC solders using stress-strain or creep data

M Motalab, Z Cai, JC Suhling… - … Conference on Thermal …, 2012 - ieeexplore.ieee.org
The Anand viscoplastic constitutive model is often used to represent the deformation
behavior of solders in electronic assemblies. In the Anand model, plasticity and creep are …

Reduction of lead free solder aging effects using doped SAC alloys

Z Cai, Y Zhang, JC Suhling, P Lall… - 2010 Proceedings …, 2010 - ieeexplore.ieee.org
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …

The effects of aging temperature on SAC solder joint material behavior and reliability

Y Zhang, Z Cai, JC Suhling, P Lall… - 2008 58th Electronic …, 2008 - ieeexplore.ieee.org
The effects of aging on mechanical behavior of lead free solders have been examined by
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …

Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation

S Xu, A Yang, Y Duan, M Li, M Peng - Materials Today Communications, 2023 - Elsevier
The phase stability, elastic properties, fracture toughness, electronic structure and thermal
conductivity of Ni-doped η'-Cu 6 Sn 5 have been obtained using first-principles calculations …

Correlation of reliability models including aging effects with thermal cycling reliability data

M Motalab, M Mustafa, JC Suhling… - 2013 IEEE 63rd …, 2013 - ieeexplore.ieee.org
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …

Constitutive and aging behavior of Sn3. 0Ag0. 5Cu solder alloy

K Mysore, G Subbarayan, V Gupta… - IEEE Transactions on …, 2009 - ieeexplore.ieee.org
We describe double-lap shear experiments on Sn3. 0Ag0. 5Cu solder alloy, from which fits
to Anand's viscoplastic constitutive model, power-law creep model, and to time-hardening …

The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder

MM Basit, M Motalab, JC Suhling… - … Conference on Thermal …, 2014 - ieeexplore.ieee.org
Lead free solder materials are widely used in electronic packaging industry due to
environmental concerns. However, experimental testing and microstructural characterization …

The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders

M Mustafa, Z Cai, JC Suhling… - 2011 IEEE 61st Electronic …, 2011 - ieeexplore.ieee.org
Solder joints in electronic assemblies are typically subjected to thermal cycling, either in
actual application or in accelerated life testing used for qualification. Mismatches in the …