Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections
G Ren, IJ Wilding, MN Collins - Journal of Alloys and Compounds, 2016 - Elsevier
Due to its commercial potential and the technological challenges associated with
processing, low temperature soldering is a topic gaining widespread interest in both industry …
processing, low temperature soldering is a topic gaining widespread interest in both industry …
Improved predictions of lead free solder joint reliability that include aging effects
It has been demonstrated that isothermal aging leads to large reductions (up to 50%) in
several key material properties for lead free solders including stiffness (modulus), yield …
several key material properties for lead free solders including stiffness (modulus), yield …
Determination of Anand constants for SAC solders using stress-strain or creep data
The Anand viscoplastic constitutive model is often used to represent the deformation
behavior of solders in electronic assemblies. In the Anand model, plasticity and creep are …
behavior of solders in electronic assemblies. In the Anand model, plasticity and creep are …
Reduction of lead free solder aging effects using doped SAC alloys
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
The effects of aging temperature on SAC solder joint material behavior and reliability
The effects of aging on mechanical behavior of lead free solders have been examined by
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) …
Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation
S Xu, A Yang, Y Duan, M Li, M Peng - Materials Today Communications, 2023 - Elsevier
The phase stability, elastic properties, fracture toughness, electronic structure and thermal
conductivity of Ni-doped η'-Cu 6 Sn 5 have been obtained using first-principles calculations …
conductivity of Ni-doped η'-Cu 6 Sn 5 have been obtained using first-principles calculations …
Correlation of reliability models including aging effects with thermal cycling reliability data
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
Constitutive and aging behavior of Sn3. 0Ag0. 5Cu solder alloy
We describe double-lap shear experiments on Sn3. 0Ag0. 5Cu solder alloy, from which fits
to Anand's viscoplastic constitutive model, power-law creep model, and to time-hardening …
to Anand's viscoplastic constitutive model, power-law creep model, and to time-hardening …
The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder
Lead free solder materials are widely used in electronic packaging industry due to
environmental concerns. However, experimental testing and microstructural characterization …
environmental concerns. However, experimental testing and microstructural characterization …
The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders
Solder joints in electronic assemblies are typically subjected to thermal cycling, either in
actual application or in accelerated life testing used for qualification. Mismatches in the …
actual application or in accelerated life testing used for qualification. Mismatches in the …