Carbon nanotubes for electronics manufacturing and packaging: From growth to integration

J Liu, D Jiang, Y Fu, T Wang - Advances in Manufacturing, 2013 - Springer
Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties.
They are light in weight yet stronger than most of the other materials. They can be made both …

Enhanced capacity and rate capability of carbon nanotube based anodes with titanium contacts for lithium ion batteries

RA DiLeo, A Castiglia, MJ Ganter, RE Rogers… - Acs Nano, 2010 - ACS Publications
Carbon nanotubes are being considered for adoption in lithium ion batteries as both a
current collector support for high-capacity active materials (replacing traditional metal foils) …

Evaluating carbon nanotube global interconnects for chip multiprocessor applications

S Pasricha, FJ Kurdahi, N Dutt - IEEE transactions on very large …, 2009 - ieeexplore.ieee.org
In ultra-deep submicrometer (UDSM) technologies, the current paradigm of using copper
(Cu) interconnects for on-chip global communication is rapidly becoming a serious …

Metallic single-walled, carbon nanotube temperature sensor with self heating

KM Mohsin, YM Banadaki… - … , Biosensors, and Info …, 2014 - spiedigitallibrary.org
A metallic single-walled carbon nanotube (SWCNT) has been proposed as a highly
sensitive temperature sensor with consideration of self-heating induced scattering. This …

Electrical transport measurements of the side-contacts and embedded-end-contacts of platinum leads on the same single-walled carbon nanotube

X Song, X Han, Q Fu, J Xu, N Wang, DP Yu - Nanotechnology, 2009 - iopscience.iop.org
In this work, we made both side-contact and embedded-end-contact Pt leads on the same
individual carbon nanotube (CNT). The radial breathing mode (RBM) peak in the Raman …

A method to form self-aligned carbon-nanotube-vias using a Ta-cap layer on a Co-catalyst

TL Liu, HW Wu, CY Wang, SY Chen, MH Hung… - Carbon, 2013 - Elsevier
A method to form self-aligned carbon nanotube (CNT) vias using a Ta-cap layer on a Co
catalyst by chemical vapor deposition at 400° C is described. The Ta-cap layer protects the …

Use of carbon nanotubes in potential electronics packaging applications

J Liu, T Wang, Y Fu, L Ye - 10th IEEE International Conference …, 2010 - ieeexplore.ieee.org
Packaging of electronics is an important technology to interconnect, power, cool and protect
the components in highly integrated systems. Continuous size shrinking and function …

Chemically vapor deposited carbon nanotubes for vertical electronics interconnect in packaging applications

J Liu, Y Fu, D Jiang - … Conference on Solid-State and Integrated …, 2014 - ieeexplore.ieee.org
Carbon Nanotubes (CNTs) have excellent electrical, thermal and mechanical properties.
They are mechanically strong at nanoscale yet also flexible if made micro-or milli-meter …

[PDF][PDF] of [2dlog2 (d) e 0 2] tdc when dlog2 (d) e 0 log2 (d)< log2 (4= 3) else

S Pasricha, FJ Kurdahi, N Dutt - IEEE TRANSACTIONS ON VERY LARGE …, 2010 - Citeseer
In ultra-deep submicrometer (UDSM) technologies, the cur-rent paradigm of using copper
(Cu) interconnects for on-chip global communication is rapidly becoming a serious …

Integration of Carbon Nanotubes in Microelectronics

SA Moshkalev, C Veríssimo, RV Gelamo… - Solid State Circuits …, 2010 - books.google.com
Carbon nanotubes (CNTs) has received much attention since their discovery in 1991 due to
unique combination of interesting electrical, mechanical, thermal and other properties, and …