In the applications of offshore wind turbines and high-speed trains, the power electronic
devices suffer in harsh working conditions of high humidity. The moisture invades devices …

Thermosetting polymer composites are often exposed to wet and humid environments,
leading to a considerable reduction in their thermo-mechanical properties. Hence, accurate …

The risk of corrosion poses a challenge to meet the stringent reliability requirements of
microelectronic devices that are used in harsh environments. Microelectronic devices are …

This study made an attempt to predict the temperature-dependent moisture diffusion of an
epoxy molding compound with 3 different diffusion models: Fickian, dual stage and …

To study the effect of chain flexibility and polarity on the water absorption and thermal-
mechanical properties of epoxy materials, different kinds of bio-based novolac resin …

Since the early 1980s, highly accelerated stress tests (HAST) have been used as an industry-
standard method to qualify the correlated moisture-enhanced, and temperature-accelerated …

Molding compounds (MCs) are widely used as an encapsulation material for integrated
circuits; however, traditional MCs are susceptible to moisture and charge spreading over …

Since the early 1980s, the highly accelerated stress test in conjunction with conventional
temperature–humidity–bias testing has been the industry-standard method for interpreting …

Abstract Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from
environmental influences, with one of these influences being moisture ingress, causing …

Cu bond wires in microelectronics have great potential but also provides several challenges.
The acceleration factors or failure mechanisms in reliability tests are somewhat different with …