Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization
In this paper, tribological effects on the material removal rate (MRR) are investigated using
two types of slurry abrasives (ie, ceria and silica) and three types of pads. From a micro to …
two types of slurry abrasives (ie, ceria and silica) and three types of pads. From a micro to …
Simulation and experimental investigation of the radial groove effect on slurry flow in oxide chemical mechanical polishing
Featured Application This research predicted the slurry saturation time with simulations,
which were verified with experiments. This work will help guide polishing recipe …
which were verified with experiments. This work will help guide polishing recipe …
Simulation of slurry residence time during chemical-mechanical polishing using 3-D computational fluid dynamics
Chemical-mechanical polishing (CMP) is commonly used in semiconductor fabrication for
flattening wafer surfaces. The study uses 3-D computational fluid dynamics (CFD) to …
flattening wafer surfaces. The study uses 3-D computational fluid dynamics (CFD) to …
Research on the shear thickening polishing CaF2 with textured hollow polishing tool
X He, L Yang, K Zhang, R Li, Y Peng - Journal of Manufacturing Processes, 2024 - Elsevier
Due to its excellent precision and surface quality, ultra-precision polishing has become a
necessary machining technology for obtaining ultra-smooth surface. Shear thickening …
necessary machining technology for obtaining ultra-smooth surface. Shear thickening …
CMP 抛光垫表面及材料特性对抛光效果影响的研究进展.
梁斌, 高宝红, 刘鸣瑜, 霍金向, 贺斌… - Micronanoelectronic …, 2024 - search.ebscohost.com
对化学机械抛光(CMP) 工艺中的抛光垫特性, 劣化以及修整进行了简单阐述,
重点先从抛光垫表面特性(抛光垫表面微形貌, 微孔及抛光垫的结构, 表面沟槽纹理的形状 …
重点先从抛光垫表面特性(抛光垫表面微形貌, 微孔及抛光垫的结构, 表面沟槽纹理的形状 …
Investigation of Polisher Head and Slurry Sweep Effect in Oxide Film Polishing
Chemical mechanical polishing (CMP) has undergone rapid advancements in global and
local planarization. The synergy between the process control and the consumables is critical …
local planarization. The synergy between the process control and the consumables is critical …
Effect of radial grooves pads on copper chemical mechanical polishing
In this study, the effect of radial grooves (RG) pads employed in the copper chemical
mechanical polishing/planarization (CMP) process was investigated, to improve the copper …
mechanical polishing/planarization (CMP) process was investigated, to improve the copper …