In this paper, tribological effects on the material removal rate (MRR) are investigated using
two types of slurry abrasives (ie, ceria and silica) and three types of pads. From a micro to …

Featured Application This research predicted the slurry saturation time with simulations,
which were verified with experiments. This work will help guide polishing recipe …

Chemical-mechanical polishing (CMP) is commonly used in semiconductor fabrication for
flattening wafer surfaces. The study uses 3-D computational fluid dynamics (CFD) to …

Due to its excellent precision and surface quality, ultra-precision polishing has become a
necessary machining technology for obtaining ultra-smooth surface. Shear thickening …

对化学机械抛光(CMP) 工艺中的抛光垫特性, 劣化以及修整进行了简单阐述,
重点先从抛光垫表面特性(抛光垫表面微形貌, 微孔及抛光垫的结构, 表面沟槽纹理的形状 …

Chemical mechanical polishing (CMP) has undergone rapid advancements in global and
local planarization. The synergy between the process control and the consumables is critical …

In this study, the effect of radial grooves (RG) pads employed in the copper chemical
mechanical polishing/planarization (CMP) process was investigated, to improve the copper …