The continuous improvement of electronic device performances and the advancement of
packaging technology have brought greater challenges to the reliability of solder joints in …

Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Nowadays, environmental pollution is a major concern due to toxic gases released by an
increased number of vehicles, industries, and manufacturing plants worldwide. These toxic …

With the development of microelectronic packaging and increasingly specific service
environment of solder joints, much stricter requirements have been placed on the properties …

This study examined the addition of dual ceramic nanomaterials, TiO 2 and graphene (0,
0.03, 0.12, 0.21, and 0.60 wt%), to a lead-free Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) solder …

In this study, we have investigated the role of boron nitride nanotubes (BNNTs) on the
microstructural and interconnection reliability of a Sn–3.0 wt% Ag–0.5 wt% Cu (SAC305) …

The continuous scaling of copper (Cu) interconnects produced two major shortcomings–a
severe resistivity size effect and material reliability issues. Tungsten (W), with the expected …

Abstract Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have
been extensively investigated. With the extensive prevalence of 3D IC package, a major …

With the increasing demands and consequent miniaturization of electronic devices,
electromigration is posing a challenge to the reliability not only of integrated circuits but also …

In this work, the lead-free composite solder was fabricated by mixing Ni element with Sn–0.7
Cu–10Bi solder. The effect of nickel (Ni) addition on the growth behavior of intermetallic …