Phase change materials provide desirable characteristics for latent heat thermal energy
storage by keeping the high energy density and quasi isothermal working temperature …

Evolution behavior and growth kinetics of Sn/Cu interfacial intermetallic compound (IMC)
during multiple reflows were investigated. Scanning electron microscope (SEM) and …

A data-driven approach combining together the experimental laser soldering, finite element
analysis and machine learning, has been utilized to predict the morphology of interfacial …

The magnitudes of input power and scan speed of laser heat source can affect the
morphology and size of interfacial Cu 6 Sn 5 intermetallic compound (IMC) formed or grown …

Pure Sn solder balls of initial diameter of 2 mm, having been reflow soldered on Cu
substrate at 573.15 K for 1, 2 and 5 min, were subjected to furnace cooling. Upon the start of …

The intermetallic compound growth in Sn/Cu and Sn–3.5 Ag/Cu solder joints undergoing
cooling has been in-situ observed using synchrotron radiation X-ray imaging technique. The …

Solder ball of initial diameter 1.4 mm, was reflow soldered with Cu substrate at 523.15 K
using flux doped with Cu@ Ag core–shell nanoparticles (NPs) in the proportion 0–2 wt …

The soldering process involves the ability of a melted solder to spread and adhere on a
substrate to form a metallic bond driven by the physical and chemical properties of the …

The variation of thermal conductivity with temperature for Sn-2.0 wt.% Mg eutectic alloy was
measured to be 68.29±4.09 W/Km with a radial heat flow apparatus. The electrical …

In this study, Cu nanoparticles prepared by chemical reduction method, were doped into flux
(0–2 wt%) and disseminated to the pure Sn solder ball at 250. The enhanced spreading rate …