The existence of preferential flow paths, such as fractures and/or fault play an vital role on
the thermal breakthrough of geothermal doublet system. The interaction between the …

Ultrasonic vibration-assisted grinding (UVAG) has attracted extensive attention as it can
significantly improve the surface integrity of the machined workpiece. However, the atom …

This work investigates the grinding process of a polycrystalline NiFeCo alloy through
molecular dynamics (MD) simulation. The important factors that affect the grinding …

The roughness of the contact surface exerts a vital role in rubbing. It is still a significant
challenge to understand the microscopic contact of the rough surface at the atomic level …

Through silicon via (TSV) interconnect structure plays an essential role in high-density 3-D
integration. The tantalum (Ta)/copper (Cu) heterointerface is one of the significant interfaces …

We performed molecular dynamics simulations to study the nano-grinding process of copper-
silicon with a single diamond abrasive grain. The Cu-Si model was based on the modified …

The ion beam polishing techniques for silicon wafers play a key role in the fabrication of
optical element. However, the dynamical ion beam polishing process at nanoscale time and …

Grain size is one of the most critical factors affecting the mechanical and thermal properties
of metallic materials. In this study the effect of the grain size of a workpiece made of pure …

This work attempts to investigate contact between two self-affine fractal surfaces with one
being of a rigid solid and other of a FCC deformable body. A normal contact model between …

Abstract The copper (Cu)/tantalum (Ta) nanofilms are the vital component in the through
silicon via (TSV) wafer. However, the current lack of research on the ultra-precision …