Design and benchmarking of hybrid CMOS-spin wave device circuits compared to 10nm CMOS

O Zografos, B Sorée, A Vaysset… - 2015 IEEE 15th …, 2015 - ieeexplore.ieee.org
In this paper, we present a design and benchmarking methodology of Spin Wave Device
(SWD) circuits based on micromagnetic modeling. SWD technology is compared against a …

System technology co-optimization for advanced integration

S Pal, A Mallik, P Gupta - Nature Reviews Electrical Engineering, 2024 - nature.com
Advanced integration and packaging will drive the scaling of computing systems in the next
decade. Diversity in performance, cost and scale of the emerging systems implies that …

DTCO at N7 and beyond: patterning and electrical compromises and opportunities

J Ryckaert, P Raghavan, P Schuddinck… - … Co-optimization for …, 2015 - spiedigitallibrary.org
At 7nm and beyond, designers need to support scaling by identifying the most optimal
patterning schemes for their designs. Moreover, designers can actively help by exploring …

A paradigm shift in local interconnect technology design in the era of nanoscale multigate and gate-all-around devices

C Pan, A Naeemi - IEEE Electron Device Letters, 2015 - ieeexplore.ieee.org
As the technology scales down to the sub-10 nm nodes, the interconnect performance
becomes primarily dominated by the resistance rather than the capacitance due to the ever …

Technology/circuit/system co-optimization and benchmarking for multilayer graphene interconnects at sub-10-nm technology node

C Pan, P Raghavan, A Ceyhan… - … on Electron Devices, 2015 - ieeexplore.ieee.org
Based on realistic circuit-and system-level simulations, graphene interconnects are
analyzed in terms of multiple material properties, such as the mean free path (MFP), the …

Application of cell-aware test on an advanced 3nm CMOS technology library

Z Gao, S Malagi, MC Hu, J Swenton… - 2019 IEEE …, 2019 - ieeexplore.ieee.org
Advanced technology nodes employ a large number of innovations. In addition, they
requirescaling boosters' in the design of standard-cell libraries to be able to offer the scaling …

ASAP5: A predictive PDK for the 5 nm node

V Vashishtha, LT Clark - Microelectronics Journal, 2022 - Elsevier
We present a predictive process design kit (PDK) for the 5 nm technology node, the ASAP5
PDK. ASAP5 is not related to a particular foundry and the assumptions are derived from …

IR-drop aware Design & technology co-optimization for N5 node with different device and cell height options

L Mattii, DM Milojevic, P Debacker… - 2017 IEEE/ACM …, 2017 - ieeexplore.ieee.org
In this paper we propose a novel Design-Technology Co-Optimization (DTCO) framework
that enables PDK generation and design implementation of sub-10nm technology nodes …

Self-timed shaper circuit for wide memories in advanced cmos technologies

V Nautiyal, G Singla, S Dwivedi, S Singh… - … on Circuits and …, 2018 - ieeexplore.ieee.org
In advanced processes, metal resistance is a limiting factor for performance. At high
temperature, further increase in metal resistance causes pulse width evaporation in critical …

A smaller, faster, and more energy-efficient complementary stt-mram cell uses three transistors and a ground grid: More is actually less

R Appeltans, P Raghavan, GS Kar… - IEEE transactions on …, 2016 - ieeexplore.ieee.org
Spin-transfer torque magnetoresistance random access memory is a major contender for
static random access memory replacement in embedded caches at advanced fin field effect …