Tenfold reduction of Brownian noise in high-reflectivity optical coatings

GD Cole, W Zhang, MJ Martin, J Ye, M Aspelmeyer - Nature Photonics, 2013 - nature.com
Thermally induced fluctuations impose a fundamental limit on precision measurement. In
optical interferometry, the current bounds of stability and sensitivity are dictated by the …

Cavity optomechanics with low-noise crystalline mirrors

GD Cole - Optical Trapping and Optical Micromanipulation IX, 2012 - spiedigitallibrary.org
Cavity optomechanics is a rapidly evolving field operating at the intersection of solid-state
physics and modern optics. The fundamental process at the heart of this interdisciplinary …

Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration

JHJ Lan, W Zhang, Y Du, YJ Lee, S Gu, J Xie - US Patent 9,922,956, 2018 - Google Patents
A microelectromechanical system (MEMS) bond release structure is provided for
manufacturing of three-dimensional integrated circuit (3D IC) devices with two or more tiers …

InAs/GaAs quantum dot laser epitaxially grown on on-axis (001) GaAsOI substrate

H Liang, T Jin, C Chi, J Sun, X Zhang, T You… - Optics …, 2021 - opg.optica.org
Quantum dot (QD) laser as a light source for silicon optical integration has attracted great
research attention because of the strategic vision of optical interconnection. In this paper, the …

[HTML][HTML] Graphene as a buffer layer for silicon carbide-on-insulator structures

B Astuti, M Tanikawa, SFA Rahman, K Yasui… - Materials, 2012 - mdpi.com
We report an innovative technique for growing the silicon carbide-on-insulator (SiCOI)
structure by utilizing polycrystalline single layer graphene (SLG) as a buffer layer. The …

[HTML][HTML] XeF2 etching of epitaxial Nb2N for lift-off or micromachining of III-N materials and devices

BP Downey, DS Katzer, N Nepal, MT Hardy… - Journal of Vacuum …, 2017 - pubs.aip.org
This paper presents characterization of the effects of XeF 2 vapor phase etching conditions
on the lateral etch rate and etch uniformity of a sacrificial, epitaxial Nb 2 N layer grown …

Germanium-on-insulator virtual substrate for InGaP epitaxy

S Bao, KH Lee, C Wang, B Wang, RI Made… - Materials Science in …, 2017 - Elsevier
In this work, we investigate the bonding processes to improve Germanium-on-insulator (GOI)
quality for III–V integration, and an InGaP LED has been grown and characterized on this …

Pengaruh temperatur deposisi pada penumbuhan film tipis silikon karbida dengan metode homemade hot-mesh chemical vapor deposition

B Astuti, AM Hashim - Indonesian Journal of Mathematics and …, 2015 - journal.unnes.ac.id
Film tipis silikon karbida (SiC) telah ditumbuhkan di atas substrate graphene/SiO2/Si
dengan metode Homemade Hot-mesh chemical vapor deposition (Hot-Mesh CVD) …

Interface engineering for exfoliation and integration of heteroepitaxial III-V films

Y Kim - 2020 - dspace.mit.edu
In this work, we introduce two novel processes for the exfoliation of III-V devices that also
enable the reuse of the substrate for continuous processing. We first investigate a novel …

Fabrication and application of GaAs-on-insulator structure prepared through liquid-phase chemical-enhanced oxidation

YS Chen, CY Kao, KW Lee, YH Wang - Vacuum, 2020 - Elsevier
This paper details the fabrication and characteristics of Schottky-gate InGaP/InGaAs
pseudomorphic high-electron-mobility transistors (PHEMTs) with GaAs-on-insulator (GOI) …