Noise and Defects in Microelectronic Materials and Devices
DM Fleetwood - IEEE Transactions on Nuclear Science, 2015 - ieeexplore.ieee.org
This paper reviews and compares predictions of the Dutta-Horn model of low-frequency
excess (1/f) noise with experimental results for thin metal films, MOS transistors, and …
excess (1/f) noise with experimental results for thin metal films, MOS transistors, and …
Spin-transistor electronics: An overview and outlook
S Sugahara, J Nitta - Proceedings of the IEEE, 2010 - ieeexplore.ieee.org
Spin transistors are a new concept device that unites an ordinary transistor with the useful
functions of a spin (magnetoresistive) device. They are expected to be a building block for …
functions of a spin (magnetoresistive) device. They are expected to be a building block for …
Two-dimensional materials and their prospects in transistor electronics
F Schwierz, J Pezoldt, R Granzner - Nanoscale, 2015 - pubs.rsc.org
During the past decade, two-dimensional materials have attracted incredible interest from
the electronic device community. The first two-dimensional material studied in detail was …
the electronic device community. The first two-dimensional material studied in detail was …
III–V compound semiconductor transistors—from planar to nanowire structures
Conventional silicon transistor scaling is fast approaching its limits. An extension of the logic
device roadmap to further improve future performance increases of integrated circuits is …
device roadmap to further improve future performance increases of integrated circuits is …
Germanium based field-effect transistors: Challenges and opportunities
The performance of strained silicon (Si) as the channel material for today's metal-oxide-
semiconductor field-effect transistors may be reaching a plateau. New channel materials …
semiconductor field-effect transistors may be reaching a plateau. New channel materials …
High-Mobility Ge pMOSFET With 1-nm EOT Gate Stack Fabricated by Plasma Post Oxidation
R Zhang, T Iwasaki, N Taoka… - IEEE Transactions on …, 2011 - ieeexplore.ieee.org
An ultrathin equivalent oxide thickness (EOT) Al 2 O 3/GeO x/Ge gate stack with a superior
GeO x/Ge metal-oxide-semiconductor (MOS) interface and p-channel metal-oxide …
GeO x/Ge metal-oxide-semiconductor (MOS) interface and p-channel metal-oxide …
Al2O3/GeOx/Ge gate stacks with low interface trap density fabricated by electron cyclotron resonance plasma postoxidation
R Zhang, T Iwasaki, N Taoka, M Takenaka… - Applied Physics …, 2011 - pubs.aip.org
An electron cyclotron resonance (ECR) plasma postoxidation method has been employed
for forming Al 2 O 3/GeO x/Ge metal-oxide-semiconductor (MOS) structures. X-ray …
for forming Al 2 O 3/GeO x/Ge metal-oxide-semiconductor (MOS) structures. X-ray …
The evolution of silicon photonics as an enabling technology for optical interconnection
JK Doylend, AP Knights - Laser & Photonics Reviews, 2012 - Wiley Online Library
Silicon photonics defines a significant advancement in the development of highly integrated
devices on a single semiconductor substrate. As a revolutionizing technology it benefits from …
devices on a single semiconductor substrate. As a revolutionizing technology it benefits from …
Germanium: Epitaxy and its applications
M Bosi, G Attolini - Progress in Crystal Growth and Characterization of …, 2010 - Elsevier
This paper reviews the most important properties of germanium, gives an insight into the
newer techniques and technology for the growth of epitaxial Ge thin layers and focuses on …
newer techniques and technology for the growth of epitaxial Ge thin layers and focuses on …