Noise and Defects in Microelectronic Materials and Devices

DM Fleetwood - IEEE Transactions on Nuclear Science, 2015 - ieeexplore.ieee.org
This paper reviews and compares predictions of the Dutta-Horn model of low-frequency
excess (1/f) noise with experimental results for thin metal films, MOS transistors, and …

Spin-transistor electronics: An overview and outlook

S Sugahara, J Nitta - Proceedings of the IEEE, 2010 - ieeexplore.ieee.org
Spin transistors are a new concept device that unites an ordinary transistor with the useful
functions of a spin (magnetoresistive) device. They are expected to be a building block for …

Two-dimensional materials and their prospects in transistor electronics

F Schwierz, J Pezoldt, R Granzner - Nanoscale, 2015 - pubs.rsc.org
During the past decade, two-dimensional materials have attracted incredible interest from
the electronic device community. The first two-dimensional material studied in detail was …

III–V compound semiconductor transistors—from planar to nanowire structures

H Riel, LE Wernersson, M Hong, JA Del Alamo - Mrs Bulletin, 2014 - cambridge.org
Conventional silicon transistor scaling is fast approaching its limits. An extension of the logic
device roadmap to further improve future performance increases of integrated circuits is …

Germanium based field-effect transistors: Challenges and opportunities

PS Goley, MK Hudait - Materials, 2014 - mdpi.com
The performance of strained silicon (Si) as the channel material for today's metal-oxide-
semiconductor field-effect transistors may be reaching a plateau. New channel materials …

High-Mobility Ge pMOSFET With 1-nm EOT Gate Stack Fabricated by Plasma Post Oxidation

R Zhang, T Iwasaki, N Taoka… - IEEE Transactions on …, 2011 - ieeexplore.ieee.org
An ultrathin equivalent oxide thickness (EOT) Al 2 O 3/GeO x/Ge gate stack with a superior
GeO x/Ge metal-oxide-semiconductor (MOS) interface and p-channel metal-oxide …

Al2O3/GeOx/Ge gate stacks with low interface trap density fabricated by electron cyclotron resonance plasma postoxidation

R Zhang, T Iwasaki, N Taoka, M Takenaka… - Applied Physics …, 2011 - pubs.aip.org
An electron cyclotron resonance (ECR) plasma postoxidation method has been employed
for forming Al 2 O 3/GeO x/Ge metal-oxide-semiconductor (MOS) structures. X-ray …

Gate oxides beyond SiO2

DG Schlom, S Guha, S Datta - MRS bulletin, 2008 - cambridge.org
This year marks a major materials milestone in the makeup of silicon-based field-effect
transistors: in the microprocessors produced by leading manufacturers, the SiO2 gate …

The evolution of silicon photonics as an enabling technology for optical interconnection

JK Doylend, AP Knights - Laser & Photonics Reviews, 2012 - Wiley Online Library
Silicon photonics defines a significant advancement in the development of highly integrated
devices on a single semiconductor substrate. As a revolutionizing technology it benefits from …

Germanium: Epitaxy and its applications

M Bosi, G Attolini - Progress in Crystal Growth and Characterization of …, 2010 - Elsevier
This paper reviews the most important properties of germanium, gives an insight into the
newer techniques and technology for the growth of epitaxial Ge thin layers and focuses on …