The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma

KS Kim, JO Bang, YH Choa, SB Jung - Microelectronic engineering, 2013 - Elsevier
There are two main technologies for the commercialization of printable and flexible
electronic devices. One is the manufacture of nanomaterials such as nanoinks and …

Effects of sintering conditions on microstructure and characteristics of screen-printed Ag thin film

KS Kim, WR Myung, SB Jung - Electronic Materials Letters, 2012 - Springer
Direct printing techniques can provide a shorter manufacturing time, lower cost, and greater
environmental friendliness compared to conventional photolithography. The electrical and …

Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate

KS Kim, Y Kim, SB Jung - Nanoscale research letters, 2012 - Springer
The microstructural evolution and the adhesion of an Ag nanopaste screen-printed on a
silicon substrate were investigated as a function of sintering temperature. Through the two …

Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma

KS Kim, YT Kwon, YH Choa, SB Jung - Microelectronic engineering, 2013 - Elsevier
Highly contrasting surface energies were induced on polyimide (PI) substrates using
atmospheric-pressure plasma (APP) to allow precise printing of Ag electrodes that showed …

Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance

KS Kim, KH Jung, BG Park, YE Shin… - Journal of Nanoscience …, 2013 - ingentaconnect.com
Direct printing such as inkjet, gravure, and screen printing is an attractive approach for
achieving low-cost circuitry in the printed circuit board industry. One of the challenges for …

Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications

DU Kim, KS Kim, SB Jung - Microelectronics Reliability, 2016 - Elsevier
High reliability has become one of the crucial requirements for portable electronic devices,
due to the high dependence of their radio frequency (RF) characteristics on the end-user's …

[HTML][HTML] High-speed sintering of Ag-based composite ink by nano-soldering

우림최, 종현이 - Journal of Welding and Joining, 2018 - e-jwj.org
To develop a fast formation method of conductive films by liquid phase sintering using a
normal reflow process, a composite ink was fabricated by mixing a commercial ink …

Effects of Temperature/Humidity Treatment Conditions on the Peel Strength between Screen-printed Ag and Polyimide Films

H Lee, BH Bae, K Son, G Kim… - Journal of the …, 2022 - koreascience.kr
Abstract Effect of temperature/humidity (T/H) treatment conditions on the peel strength of
screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90 peel test …

The Improvement of Electrical Characteristics of Inkjet-printed Cu films with Stress Relaxation during Thermal Treatment

SM Yi, YC Joo - Journal of the Microelectronics and Packaging …, 2014 - koreascience.kr
Using flexible bismaleimide-triazine co-polymer as a substrate, inkjet-printed Cu films were
also investigated for low-cost and process feasibility of flexible electronics. After annealing at …

Reliability of chip on glass module fabricated with direct printing method

YC Lee, JW Kim, Y Kim, SB Jung - Microelectronic engineering, 2013 - Elsevier
To investigate the effect of the sintering temperature on the electrical properties of a chip on
glass (COG) module, a screen-printed conductive circuit was sintered at various …