The technology of three-dimensional integrated circuits (3D ICs) has the potential to
diminish the size of packages, decrease interconnect delays, lower energy usage, and …

As physical transistor scaling nears its fundamental limits and many applications are
increasingly bottlenecked by memory bandwidth, three-dimensional (3D) integration is a …

Self-heating inhibits the electrical characteristics improvement of GaN devices. The local
hotspots generated in the gate region significantly affect the output performance of GaN …

Surge in compute-demand in consumer products, mobile phones, auto mobiles, datacenters
for high performance computing (HPC) applications brings in major thermal challenges. This …

Heat Transfer-Advances in Fundamentals and Applications explores new knowledge in the
domain of fundamental and applied advances in heat transfer. This book specifically …

In this paper, signal integrity (SI) performance has been investigated for advanced
interconnect bridge on organic package (AIBO) technology. Performance comparison under …

Thermal management is today a primary focus in the electronics industry due to the
continuous increase of power density in chips increasingly smaller in size, which has …

Power throttling with dynamic voltage and frequency scaling (DVFS) is important to the
dynamic thermal management (DTM) of processors. With increasing numbers of on-chip …

Dynamic thermal management (DTM) generally allows dynamic manipulation of hardware
or software to better handle extreme usage scenarios, thereby enabling improved design …