Semiconductor cooling arrangement

SD Hart, T Woolmer, CS Malam, G Law… - US Patent …, 2021 - Google Patents
The present invention relates to a semiconductor cooling arrangement for cooling
semiconductor devices, such as power semiconductors. The semiconductor cooling arrange …

Modular microjet cooling of packaged electronic components

JP Smith, BA MALOUIN, EA Browne - US Patent 10,665,529, 2020 - Google Patents
The present invention generally relates to a modular microjet cooler. The modular microjet
cooler may be attached to a packaged heat generating device that is mounted on a printed …

Thermal management of RF devices using embedded microjet arrays

BA MALOUIN, JP Smith, EA Browne - US Patent 10,651,112, 2020 - Google Patents
The present invention generally relates to a microjet array for use as a thermal management
system for a heat generating device, such as an RF device. The microjet array is formed in a …

Heat dissipation solution for advanced chip packages

F Hou, T Lin - US Patent 9,653,378, 2017 - Google Patents
A solution for dissipating heat generated from high power chip packages, eg, a fcBGA
package, wbBGA package, 2.5 D/3D TSV package, PoP, etc. The heat dissipation system …

Cooling apparatus and methods of use

DL Sherrer, CR Jacobsen, DR Hobby… - US Patent …, 2020 - Google Patents
Illustrative embodiments disclosed herein pertain to a cool ing apparatus that includes a
distributor plate and a conduit assembly. The conduit assembly allows a cooling fluid to flow …

Thermal management of RF devices using embedded microjet arrays

BA MALOUIN, JP Smith, EA Browne - US Patent 10,903,141, 2021 - Google Patents
The present invention generally relates to a microjet array for use as a thermal management
system for a heat gener ating device, such as an RF device. The microjet array is formed in a …

Board assembly including cooling system and electronic apparatus

K Katsumata, J Wei, M Suzuki - US Patent 9,717,161, 2017 - Google Patents
A board assembly including a cooling system includes: a wiring board; a first heat
generating component mounted on a surface of the wiring board; a first heat receiving …

Inverter arrangement

SD Hart, T Woolmer, CS Malam, T Hillman… - US Patent …, 2022 - Google Patents
(57) ABSTRACT A semiconductor arrangement and an inverter incorporating the
semiconductor arrangement, in particular to an inverter for use with traction power units eg …

Thermal management of RF devices using embedded microjet arrays

BA MALOUIN, JP Smith, EA Browne - US Patent 11,322,426, 2022 - Google Patents
The present invention generally relates to a microjet array for use as a thermal management
system for a heat generating device, such as an RF device. The microjet array is formed in a …

Modular microjet cooling of packaged electronic components

JP Smith, BA MALOUIN, EA Browne - US Patent 11,018,077, 2021 - Google Patents
The present invention generally relates to a modular microjet cooler. The modular microjet
cooler may be attached to a packaged heat generating device that is mounted on a printed …