Semiconductor cooling arrangement
SD Hart, T Woolmer, CS Malam, G Law… - US Patent …, 2021 - Google Patents
The present invention relates to a semiconductor cooling arrangement for cooling
semiconductor devices, such as power semiconductors. The semiconductor cooling arrange …
semiconductor devices, such as power semiconductors. The semiconductor cooling arrange …
Modular microjet cooling of packaged electronic components
JP Smith, BA MALOUIN, EA Browne - US Patent 10,665,529, 2020 - Google Patents
The present invention generally relates to a modular microjet cooler. The modular microjet
cooler may be attached to a packaged heat generating device that is mounted on a printed …
cooler may be attached to a packaged heat generating device that is mounted on a printed …
Thermal management of RF devices using embedded microjet arrays
BA MALOUIN, JP Smith, EA Browne - US Patent 10,651,112, 2020 - Google Patents
The present invention generally relates to a microjet array for use as a thermal management
system for a heat generating device, such as an RF device. The microjet array is formed in a …
system for a heat generating device, such as an RF device. The microjet array is formed in a …
Heat dissipation solution for advanced chip packages
F Hou, T Lin - US Patent 9,653,378, 2017 - Google Patents
A solution for dissipating heat generated from high power chip packages, eg, a fcBGA
package, wbBGA package, 2.5 D/3D TSV package, PoP, etc. The heat dissipation system …
package, wbBGA package, 2.5 D/3D TSV package, PoP, etc. The heat dissipation system …
Cooling apparatus and methods of use
DL Sherrer, CR Jacobsen, DR Hobby… - US Patent …, 2020 - Google Patents
Illustrative embodiments disclosed herein pertain to a cool ing apparatus that includes a
distributor plate and a conduit assembly. The conduit assembly allows a cooling fluid to flow …
distributor plate and a conduit assembly. The conduit assembly allows a cooling fluid to flow …
Thermal management of RF devices using embedded microjet arrays
BA MALOUIN, JP Smith, EA Browne - US Patent 10,903,141, 2021 - Google Patents
The present invention generally relates to a microjet array for use as a thermal management
system for a heat gener ating device, such as an RF device. The microjet array is formed in a …
system for a heat gener ating device, such as an RF device. The microjet array is formed in a …
Board assembly including cooling system and electronic apparatus
K Katsumata, J Wei, M Suzuki - US Patent 9,717,161, 2017 - Google Patents
A board assembly including a cooling system includes: a wiring board; a first heat
generating component mounted on a surface of the wiring board; a first heat receiving …
generating component mounted on a surface of the wiring board; a first heat receiving …
Inverter arrangement
SD Hart, T Woolmer, CS Malam, T Hillman… - US Patent …, 2022 - Google Patents
(57) ABSTRACT A semiconductor arrangement and an inverter incorporating the
semiconductor arrangement, in particular to an inverter for use with traction power units eg …
semiconductor arrangement, in particular to an inverter for use with traction power units eg …
Thermal management of RF devices using embedded microjet arrays
BA MALOUIN, JP Smith, EA Browne - US Patent 11,322,426, 2022 - Google Patents
The present invention generally relates to a microjet array for use as a thermal management
system for a heat generating device, such as an RF device. The microjet array is formed in a …
system for a heat generating device, such as an RF device. The microjet array is formed in a …
Modular microjet cooling of packaged electronic components
JP Smith, BA MALOUIN, EA Browne - US Patent 11,018,077, 2021 - Google Patents
The present invention generally relates to a modular microjet cooler. The modular microjet
cooler may be attached to a packaged heat generating device that is mounted on a printed …
cooler may be attached to a packaged heat generating device that is mounted on a printed …