Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects

EP Li, XC Wei, AC Cangellaris, EX Liu… - IEEE Transactions …, 2010 - ieeexplore.ieee.org
The ever-increasing demands of digital computing and wireless communication have been
driving the semiconductor technology to change with each passing day. Modern electronic …

[图书][B] Approximation of large-scale dynamical systems

AC Antoulas - 2005 - SIAM
In today's technological world, physical and artificial processes are mainly described by
mathematical models, which can be used for simulation or control. These processes are …

[图书][B] Circuit oriented electromagnetic modeling using the PEEC techniques

A Ruehli, G Antonini, L Jiang - 2017 - books.google.com
Bridges the gap between electromagnetics and circuits by addressing electrometric
modeling (EM) using the Partial Element Equivalent Circuit (PEEC) method This book …

Passivity enforcement via perturbation of Hamiltonian matrices

S Grivet-Talocia - IEEE Transactions on Circuits and Systems I …, 2004 - ieeexplore.ieee.org
This paper presents a new technique for the passivity enforcement of linear time-invariant
multiport systems in state-space form. This technique is based on a study of the spectral …

Numerical electromagnetic field analysis for EMC problems

HD Bruns, C Schuster, H Singer - IEEE Transactions on …, 2007 - ieeexplore.ieee.org
Much progress has been made in the use of computational electromagnetics for the analysis
of electromagnetic compatibility (EMC) problems during recent years. This paper reviews the …

Performance analysis of the IEEE 802.16 wireless metropolitan area network

DH Cho, JH Song, MS Kim… - … Conference on Distributed …, 2005 - ieeexplore.ieee.org
In this paper, we propose a new QoS architecture for the IEEE 802.16 a MAC protocol and
present a bandwidth allocation and admission control policy for the architecture. Our …

Automatic Model Reduction for Transient Simulation of MEMS‐based Devices

EB Rudnyi, JG Korvink - Sensors update, 2002 - Wiley Online Library
The rapid development of MEMS‐based devices requires 3D time‐dependent simulations
for coupled physical domains (thermal, mechanical, electrical, etc.). This in turn requires the …

A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects

EP Li, EX Liu, LW Li, MS Leong - IEEE Transactions on …, 2004 - ieeexplore.ieee.org
This paper presents an accurate and systematic approach for analysis of the signal integrity
of the high-speed interconnects, which couples the full-wave finite difference time domain …

Modeling and measurements of parasitic parameters for integrated power electronics modules

JZ Chen, L Yang, D Boroyevich… - … Annual IEEE Applied …, 2004 - ieeexplore.ieee.org
In this paper, the parasitic inductance and capacitance of integrated power electronics
modules (IPEMs) were modeled using Maxwell Q3D extractor. The IPEMs were then …

Multipoint full-wave model order reduction for delayed PEEC models with large delays

F Ferranti, MS Nakhla, G Antonini… - IEEE Transactions …, 2011 - ieeexplore.ieee.org
The increase of operating frequencies requires 3-D electromagnetic (EM) methods, such as
the partial element equivalent circuit (PEEC) method, for the analysis and design of high …