The term 3D IC generally means an IC package having multiple device layers, which is
different with 3D transistor structures such as the FinFET. 3D packaging and 3D integration …

Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued
by researchers and chip manufacturers. This architecture allows extremely high level of …

Targeted at addressing practical thermal issues of 3D-IC chip, heat transfer characteristics
and temperature uniformity of gradient distribution solid and annular-cavity micro-pin fins are …

The presence of variable heat fluxes, such as localized hotspots in integrated circuit (IC)
architectures poses a key challenge for thermal management of existing (2D) and emerging …

While 3-D integrated circuits (ICs) offer many advantages over 2-D ICs, thermal
management challenges remain unresolved. Thermal through-silicon-vias (TTSVs) are …

Targeting at improving temperature uniformity for intra-chip cooling, present work
experimentally and numerically investigates the influence of flow rate, heat flux density, fluid …

Targeting at reducing temperature gradient in the direct intra-chip cooling, embedded
gradient distribution micro pin fin arrays are fabricated. The flow characteristics and …

Using microfluidic cooling to achieve thermal management of three-dimensional integrated
circuits (ICs) is recognized as a promising method of extending Moore law progression in …

The vertical integration of microelectronics is an appealing approach that offers significant
performance advantages over conventional planar devices. However, one of the main …