Copper-based diamond composites have been the focus of many investigations for higher
thermal conductivity applications. However, the natural non-wetting behavior between …

Since a nanometer-thick carbide layer will be indispensably produced on diamond to ensure
wettability with metallic parts, the interfacial properties of diamond/carbide directly affect the …

High-efficiency heat dissipation is crucial for the reliability and durability of high-power
electronics devices. Diamond/copper composites have drawn much attention as promising …

In this study,(diamond+ TiC) reinforced Ti6Al4V titanium matrix composites (DT-TMCs) were
fabricated using the directed energy deposition (DED) technique to enhance multiple …

To solve the overheating problem during the operation of integrated devices, a rectangular
microchannel heat sink (MCHS) was prepared using high thermal conductivity …

Joining diamond and metal is vital to expand their application scope in electronic and
military industries. A metallic carbide layer will be inevitably introduced on diamond to …

The heat transport enhancement of diamond/Cu composites, a new generation of thermal
management materials, is trapped in the bonding strength-heat transfer trade-off dilemma at …

Controlling diamond structures with nanometer precision is fundamentally challenging
owing to their extreme and far‐from‐equilibrium synthetic conditions. State‐of‐the‐art …

Cu/diamond composite is a promising thermal management material for heat dissipation of
high-power electronic devices. Heat transfer models for a Cu-B/diamond composite with …

Diamond particles reinforced Cu matrix (Cu/diamond) composites have promising
applications for heat dissipation of high-power electronic devices because of their high …