As the heat dissipation requirements of micro-electronic component systems have increased
by magnitude, scientists and engineers have shifted their focus from traditional single-phase …

This paper investigates the advantages and challenges associated with two-phase flows,
specifically flow boiling of pure liquids and nanofluids, for cooling applications in …

One ultrahigh-aspect-ratio copper microchannel heat sink (AR= 25) was fabricated with wire
electrical discharge machining technique, in which the flow boiling heat transfer of deionized …

The present work is to solve or suppress the two-phase flow boiling instability. A
comprehensive review shows the research progress of flow instability types, experimental …

Targeted at addressing practical thermal issues of 3D-IC chip, heat transfer characteristics
and temperature uniformity of gradient distribution solid and annular-cavity micro-pin fins are …

In this paper, nine Microchannel Heat sinks (MCHs) all with channel lengths of 20 mm and
heights of 1 mm but with different aspect ratios 1.33; 2 and 4, wall thicknesses 0.25–0.75 …

Silicon microchannels with microporous decorated sidewalls were applied to enhance water
flow boiling heat transfer, especially the critical heat flux (CHF). In experiments, a CHF of …

The performance of microchannel with sidewall dimples and fillet profile in the bottom
surface is investigated. Two dimple sizes of (0.5 mm and 1 mm) are systematically clustered …

Flow boiling in microchannels shows high potential to cope with the high power density
dissipation for electronic devices. However, it is a challenge to promote the heat transfer …

Targeting at decreasing the pressure drop in the micro heat sink, a gradient distribution pin
fin arrays and narrow slots (GPN) is proposed. In addition, in order to further reduce the …