Marine pollution is one of the biggest environmental problems, mainly due to single-use or
disposable plastic waste fragmenting into microplastics (MPs) and nanoplastics (NPs) and …

Integrated circuits (ICs) are challenged to deliver historically anticipated performance
improvements while increasing the cost and complexity of the technology with each …

Copper electrodeposition on copper from still plating solutions of different compositions was
investigated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry …

An organic additive, Diazine Black (DB), was employed as a leveler for microvia filling using
copper electroplating. DB is a derivative of Janus Green B (JGB), which is a common leveler …

Superconformal film growth is a key process in state-of-the-art Cu metallization of electronic
devices. Superfilling of recessed surface features results from the competition between …

The adsorption and activation of bis (3-sulfopropyl)-disulfide (SPS) has been studied using a
microfluidic electrochemical device. The device provides for accurate transitioning of …

A plating process for microvia filling by Cu electroplating, carried out in a plating bath without
an accelerator but with a suppressor only, is proposed in this work. The seed layer of …

Copper metal is widely electroplated for microelectronic interconnections such as
redistribution layers (RDL), pillar bumps, through silicon vias, etc. With advances of …

We evaluate the effect of chain length for a series of alkyl sulfonic acid additives on Cu
electrodeposition by using a combination of electrochemical and Raman spectroscopic …

The mechanical characteristics of electrochemically deposited copper coatings have been
examined by application of two hardness composite models: the Chicot-Lesage (CL) and …