Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective

Y Qin, B Albano, J Spencer, JS Lundh… - Journal of physics D …, 2023 - iopscience.iop.org
Power semiconductor devices are fundamental drivers for advances in power electronics,
the technology for electric energy conversion. Power devices based on wide-bandgap …

A review of GaN HEMT broadband power amplifiers

KH Hamza, D Nirmal - AEU-International Journal of Electronics and …, 2020 - Elsevier
The unique material properties of GaN, wide bandgap, high thermal conductivity, high
breakdown voltage, high electron mobility and the device properties of GaN HEMT (High …

Chemical vapour deposition synthetic diamond: materials, technology and applications

RS Balmer, JR Brandon, SL Clewes… - Journal of Physics …, 2009 - iopscience.iop.org
Substantial developments have been achieved in the synthesis of chemical vapour
deposition (CVD) diamond in recent years, providing engineers and designers with access …

Diamond as the heat spreader for the thermal dissipation of GaN-based electronic devices

L Sang - Functional Diamond, 2022 - Taylor & Francis
With the increasing power density and reduced size of the GaN-based electronic power
converters, the heat dissipation in the devices becomes the key issue toward the real …

[HTML][HTML] Thermal characterization of polycrystalline diamond thin film heat spreaders grown on GaN HEMTs

Y Zhou, R Ramaneti, J Anaya, S Korneychuk… - Applied Physics …, 2017 - pubs.aip.org
Polycrystalline diamond (PCD) was grown onto high-k dielectric passivated AlGaN/GaN-on-
Si high electron mobility transistor (HEMT) structures, with film thicknesses ranging from 155 …

High-frequency PWM buck converters using GaN-on-SiC HEMTs

M Rodríguez, Y Zhang… - IEEE transactions on …, 2013 - ieeexplore.ieee.org
GaN high electron mobility transistors (HEMTs) are well suited for high-frequency operation
due to their lower on resistance and device capacitance compared with traditional silicon …

[HTML][HTML] GaN-based heterostructures with CVD diamond heat sinks: A new fabrication approach towards efficient electronic devices

MY Chernykh, AA Andreev, IS Ezubchenko… - Applied Materials …, 2022 - Elsevier
A new approach to the fabrication of efficient heat sinks for GaN-based transistors is
demonstrated. A key feature of this work is the growth of polycrystalline diamond coating on …

Control of the in-plane thermal conductivity of ultra-thin nanocrystalline diamond films through the grain and grain boundary properties

J Anaya, S Rossi, M Alomari, E Kohn, L Tóth, B Pécz… - Acta Materialia, 2016 - Elsevier
The in-plane thermal conductivity of polycrystalline diamond near its nucleation site, which is
a key parameter to an efficient integration of diamond in modern high power AlGaN/GaN …

GaN-On-Diamond HEMT Technology With TAVG = 176°C at PDC,max = 56 W/mm Measured by Transient Thermoreflectance Imaging

MJ Tadjer, TJ Anderson, MG Ancona… - IEEE Electron …, 2019 - ieeexplore.ieee.org
Record DC power has been demonstrated in AlGaN/GaN high electron mobility transistors
fabricated using a substrate replacement process in which a thick diamond substrate is …

Identification of GaN buffer traps in microwave power AlGaN/GaN HEMTs through low frequency S-parameters measurements and TCAD-based physical device …

NK Subramani, J Couvidat, A Al Hajjar… - IEEE Journal of the …, 2017 - ieeexplore.ieee.org
In this paper, the type, activation energy (E a) and cross section (σ n) of the GaN buffer traps
existing in the AlGaN/GaN high-electron mobility transistors are investigated through low …