In the current vehicle electric propulsion systems, the thermal design of power modules
heavily relies on empirical knowledge, making it challenging to effectively optimize …

Moving toward an electrified world requires ultrahigh-density power converters. With the
adoption of wide-bandgap semiconductors (eg, SiC and GaN), the next-generation power …

Modern power electronics are experiencing significant demand for ultra-high-power density
in the grid, data center, automotive industries, and aerospace applications. To satisfy the …

Multi-Chip Power Modules (MCPM) are a critical component in power conversion
applications. Power modules and their layout optimization have been considered a crucial …

Moving towards an electrified world requires ultra high-density power converters. Electric
vehicles, electrified aerospace, data centers, etc. are just a few fields among wide …

In recent years, the fast development of Multichip Power Modules (MCPM) packaging and
Wide Bandgap (WBG) technology has enabled higher voltage and current ratings, better …