This paper presents a wideband FMCW MIMO radar sensor capable of working in the
frequency range between 120 GHz and 140 GHz. The sensor is based on a radar chipset …

This paper investigates a novel differential transition using bond wires for chip-to-chip and
chip-to-antenna connections for systems operating above 200 GHz. At mm-wave …

Wire bonds are one of the most common interconnects used in microelectronics; however,
their application to millimeter wave monolithic microwave integrated circuits (MMICs) may …

This work presents a method to realize a direct chip-to-waveguide transition by means of
commercial wire-bonding tools. A straight E-field probe is formed by a freely suspended …

Millimeter-wave (mm-wave) transmitters are often fabricated using advanced technology
and require a sophisticated manufacturing facility. Access to such technologies is often very …

Bonding wires are extensively used to provide electrical interconnections in communication
systems. From the perspective of circuit analysis, the effects of such elements are often …

This article presents an advanced bond wire interconnect solution to enable heterogeneous
system designs from DC up to and exceeding 210GHz. A wideband transition is realized by …

This letter presents a new compact chip-to-chip wire bonding technique which significantly
improves the performance over conventional wire bonding techniques by using ground …

As millimeter wave RF device applications expand above traditional microwave frequency
bands in the global communications, automotive and Mil-Aero markets, the need to limit …

In this paper, a novel differential microstrip patch antenna (DMPA) is designed and used to
feed a lens antenna for short range F-band MIMO radars. The DMPA is fed differentially by a …