This article deals with the reliability of a power semiconductor exposing to the severe
thermal stresses. The importance of solder joint thickness on the power semiconductor's …

Lead-free tin-based solder joints often have a single-grained structure with random
orientation and highly anisotropic properties. These alloys are typically stiffer than lead …

Reliability is one of the major requirements for power and opto-electronic devices across all
segments. High operation temperature and/or high thermomechanical stress cause defects …

The thermo-mechanical fatigue of different SAC+ solders is investigated using transient
thermal analysis (TTA) and predicted using artificial neural networks (ANN). TTA measures …

Silver and copper sinter processes were investigated as a replacement for SnAgCu (SAC)
solder joints for high power Thin Film (TF) LEDs (die bond) and Flip Chip (FC) LEDs …

Soldering is a dominating process for semiconductor packaging. For electronic
manufacturing tin based solders play a key role. The surface of most solder alloys is …

This article introduces a new measurement method for noise suppression in transient
thermal analysis (TTA), which is used to measure the transient thermal impedance of power …

Reliability of LED light sources is essential for many general and automotive lighting
application where exchange of LED modules would be expensive. Reliability testing to …

For automotive exterior lighting application high luminance light sources are required, ie
high current density. The interconnect between LED and board needs to have a high thermo …

With the increasing demand for highly efficient lighting in the automotive industry, flip-chip
light-emitting diodes (LEDs) have become widely used for both interior and exterior lighting …