Heterojunction oxide thin film transistors: a review of recent advances

J Lee, DS Chung - Journal of Materials Chemistry C, 2023 - pubs.rsc.org
In the last decades, oxide thin-film transistors (TFTs) have been extensively developed for
optoelectronic applications owing to their outstanding electrical properties, such as excellent …

Component cost models for multi-objective optimizations of switched-mode power converters

R Burkart, JW Kolar - 2013 IEEE Energy Conversion Congress …, 2013 - ieeexplore.ieee.org
Besides product differentiation, cost is a key parameter for market success and sustainable
competitive advantage of industrial companies. Academic research in the field of power …

Future memory and interconnect technologies

Y Xie - 2013 Design, Automation & Test in Europe Conference …, 2013 - ieeexplore.ieee.org
The improvement of the computer system performance is constrained by the well-known
memory wall and power wall. It has been recognized that the memory architecture and the …

[PDF][PDF] Advanced modeling and multi-objective optimization of power electronic converter systems

RM Burkart - 2016 - research-collection.ethz.ch
The start of the Industrial Revolution in the late 18. century marked the beginning of an
ongoing period in which technological advancements and innovations have become the …

BEOL stack-aware routability prediction from placement using data mining techniques

WTJ Chan, Y Du, AB Kahng, S Nath… - 2016 IEEE 34th …, 2016 - ieeexplore.ieee.org
In advanced technology nodes, physical design engineers must estimate whether a
standard-cell placement is routable (before invoking the router) in order to maintain …

Shrunk-2-D: A physical design methodology to build commercial-quality monolithic 3-D ICs

S Panth, K Samadi, Y Du, SK Lim - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Monolithic 3-D (M3D) integrated circuits (ICs) are an emerging technology that offer much
higher integration densities than previous 3-D IC approaches. In this paper, we present a …

High-density integration of functional modules using monolithic 3D-IC technology

S Panth, K Samadi, Y Du, SK Lim - 2013 18th Asia and South …, 2013 - ieeexplore.ieee.org
Three dimensional integrated circuits (3D-ICs) have emerged as a promising solution to
continue device scaling. They can be realized using Through Silicon Vias (TSVs), or …

FARSI: An early-stage design space exploration framework to tame the domain-specific system-on-chip complexity

B Boroujerdian, Y Jing, D Tripathy, A Kumar… - ACM Transactions on …, 2023 - dl.acm.org
Domain-specific SoCs (DSSoCs) are an attractive solution for domains with extremely
stringent power, performance, and area constraints. However, DSSoCs suffer from two …

Macro-3D: A physical design methodology for face-to-face-stacked heterogeneous 3D ICs

L Bamberg, A García-Ortiz, L Zhu… - … , Automation & Test …, 2020 - ieeexplore.ieee.org
Memory-on-logic and sensor-on-logic face-to-face stacking are emerging design
approaches that promise a significant increase in the performance of modern systems-on …

Quantifying the relationship between the power delivery network and architectural policies in a 3D-stacked memory device

M Shevgoor, JS Kim, N Chatterjee… - Proceedings of the 46th …, 2013 - dl.acm.org
Many of the pins on a modern chip are used for power delivery. If fewer pins were used to
supply the same current, the wires and pins used for power delivery would have to carry …