Heterojunction oxide thin film transistors: a review of recent advances
J Lee, DS Chung - Journal of Materials Chemistry C, 2023 - pubs.rsc.org
In the last decades, oxide thin-film transistors (TFTs) have been extensively developed for
optoelectronic applications owing to their outstanding electrical properties, such as excellent …
optoelectronic applications owing to their outstanding electrical properties, such as excellent …
Component cost models for multi-objective optimizations of switched-mode power converters
R Burkart, JW Kolar - 2013 IEEE Energy Conversion Congress …, 2013 - ieeexplore.ieee.org
Besides product differentiation, cost is a key parameter for market success and sustainable
competitive advantage of industrial companies. Academic research in the field of power …
competitive advantage of industrial companies. Academic research in the field of power …
Future memory and interconnect technologies
Y Xie - 2013 Design, Automation & Test in Europe Conference …, 2013 - ieeexplore.ieee.org
The improvement of the computer system performance is constrained by the well-known
memory wall and power wall. It has been recognized that the memory architecture and the …
memory wall and power wall. It has been recognized that the memory architecture and the …
[PDF][PDF] Advanced modeling and multi-objective optimization of power electronic converter systems
RM Burkart - 2016 - research-collection.ethz.ch
The start of the Industrial Revolution in the late 18. century marked the beginning of an
ongoing period in which technological advancements and innovations have become the …
ongoing period in which technological advancements and innovations have become the …
BEOL stack-aware routability prediction from placement using data mining techniques
In advanced technology nodes, physical design engineers must estimate whether a
standard-cell placement is routable (before invoking the router) in order to maintain …
standard-cell placement is routable (before invoking the router) in order to maintain …
Shrunk-2-D: A physical design methodology to build commercial-quality monolithic 3-D ICs
Monolithic 3-D (M3D) integrated circuits (ICs) are an emerging technology that offer much
higher integration densities than previous 3-D IC approaches. In this paper, we present a …
higher integration densities than previous 3-D IC approaches. In this paper, we present a …
High-density integration of functional modules using monolithic 3D-IC technology
Three dimensional integrated circuits (3D-ICs) have emerged as a promising solution to
continue device scaling. They can be realized using Through Silicon Vias (TSVs), or …
continue device scaling. They can be realized using Through Silicon Vias (TSVs), or …
FARSI: An early-stage design space exploration framework to tame the domain-specific system-on-chip complexity
Domain-specific SoCs (DSSoCs) are an attractive solution for domains with extremely
stringent power, performance, and area constraints. However, DSSoCs suffer from two …
stringent power, performance, and area constraints. However, DSSoCs suffer from two …
Macro-3D: A physical design methodology for face-to-face-stacked heterogeneous 3D ICs
Memory-on-logic and sensor-on-logic face-to-face stacking are emerging design
approaches that promise a significant increase in the performance of modern systems-on …
approaches that promise a significant increase in the performance of modern systems-on …
Quantifying the relationship between the power delivery network and architectural policies in a 3D-stacked memory device
M Shevgoor, JS Kim, N Chatterjee… - Proceedings of the 46th …, 2013 - dl.acm.org
Many of the pins on a modern chip are used for power delivery. If fewer pins were used to
supply the same current, the wires and pins used for power delivery would have to carry …
supply the same current, the wires and pins used for power delivery would have to carry …