In-Situ Detection of Bond Wire Lift-Off Events in Operational SiC MOSFETs
Bond wire lift-off is one of the main failure mechanisms for silicon carbide mosfet s. This
occurs when the metallurgical weld between the bond-wire and the device source breaks …
occurs when the metallurgical weld between the bond-wire and the device source breaks …
Power Cycling of Sintered SiC Power MOSFET Baseplate-less Modules with Aluminum Oxide and Silicon Nitride Substrates
I Kovacevic-Badstuebner, E Mengotti… - … Devices and ICs …, 2023 - ieeexplore.ieee.org
This paper shows a comparison of power cycling (PC) lifetime between SiC power MOSFET
baseplate-less modules with Si 3 N 4 and Al 2 O 3 DBC substrates at heating on/off-times of …
baseplate-less modules with Si 3 N 4 and Al 2 O 3 DBC substrates at heating on/off-times of …
Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package
DM Amoroso, L Donetti, B Schifano… - … and Multi-Physics …, 2024 - ieeexplore.ieee.org
In this paper, a liquid-to-liquid thermal shock test is performed on TO-247 packages. By
employing liquid with a high heat transfer coefficient as an energy transfer medium, it …
employing liquid with a high heat transfer coefficient as an energy transfer medium, it …