Methods for detection of subsurface damage: a review

J Yin, Q Bai, B Zhang - Chinese Journal of Mechanical Engineering, 2018 - Springer
Subsurface damage is easily induced in machining of hard and brittle materials because of
their particular mechanical and physical properties. It is detrimental to the strength …

Ultrasound biomicroscopy in small animal research: applications in molecular and preclinical imaging

A Greco, M Mancini, S Gargiulo… - BioMed Research …, 2012 - Wiley Online Library
Ultrasound biomicroscopy (UBM) is a noninvasive multimodality technique that allows high‐
resolution imaging in mice. It is affordable, widely available, and portable. When it is coupled …

Quantifying the subsurface damage and residual stress in ground silicon wafer using laser ultrasonic technology: A Bayesian approach

Z Liu, B Lin, X Liang, A Du - Mechanical Systems and Signal Processing, 2022 - Elsevier
Dispersion nature of surface acoustic waves (SAWs) propagating along the machined
surface contains key information about the elastic properties and stress state of the …

Noncontact laser ultrasonic inspection of ceramic matrix composites (CMCs)

R Quintero, F Simonetti, P Howard, J Friedl… - NDT & E …, 2017 - Elsevier
Ceramic matrix composites (CMCs) are poised to revolutionize jet engine technology by
enabling operation temperatures well beyond those possible with current superalloys, while …

Multimode photoacoustic characterization of subsurface damage in ground thin wafers

Z Liu, B Lin, X Liang, X Ma, Y Wan - International Journal of Mechanical …, 2023 - Elsevier
A multimode photoacoustic method has been applied for evaluating the degree of
subsurface damage (SSD) in the ground silicon wafer. Mode conversion of laser-generated …

Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering

J Yin, Q Bai, H Haitjema, B Zhang - Journal of Materials Processing …, 2020 - Elsevier
This study proposes a polarized laser scattering (PLS) method for detection of the two-
dimensional distribution of the grinding-induced subsurface damage (SSD). This study also …

Review on the various strategies adopted for the polishing of silicon wafer—A chemical perspective

M Srivastava, J Singh, DK Mishra, RP Singh - Materials Today …, 2022 - Elsevier
The need for sophisticated materials with outstanding mechanical capabilities and high-
quality surface finishes has risen as a result of recent innovations in the engineering sector …

Laser-excited surface acoustic wave method for detecting subsurface damage of processed silicon nitride ceramics

H Jia, B Lin, Z Liu, X Ma, Y Wan, W Chen, Y Li - Ceramics International, 2024 - Elsevier
The non-destructive testing for subsurface damage of processed silicon nitride ceramics is
significant to the improvement of processing technology and evaluation of product …

Acoustics at the nanoscale (nanoacoustics): A comprehensive literature review. Part I: Materials, devices and selected applications

C Peng, M Chen, JB Spicer, X Jiang - Sensors and Actuators A: Physical, 2021 - Elsevier
In the past decade, acoustics at the nanoscale (ie, nanoacoustics) has evolved rapidly with
continuous and substantial expansion of capabilities and refinement of techniques …

Rapid identification of ultrathin amorphous damage on monocrystalline silicon surface

L Wu, B Yu, P Zhang, C Feng, P Chen… - Physical chemistry …, 2020 - pubs.rsc.org
Amorphous silicon (a-Si) is a type of common surface damages during the ultra-precision
machining of monocrystalline Si. However, it is difficult to identify the amorphous damage of …