Overview of real-time lifetime prediction and extension for SiC power converters

Z Ni, X Lyu, OP Yadav, BN Singh… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Remaining useful lifetime prediction and extension of Si power devices have been studied
extensively. Silicon carbide (SiC) power devices have been developed and commercialized …

Jet impingement cooling in power electronics for electrified automotive transportation: Current status and future trends

S Jones-Jackson, R Rodriguez… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Effective thermal management of power electronics in electric vehicles is essential for
reliability and increased power density. Currently, traditional cooling technologies such as …

Artificial intelligence aided automated design for reliability of power electronic systems

T Dragičević, P Wheeler… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
This paper proposes a new methodology for automated design of power electronic systems
realized through the use of artificial intelligence. Existing approaches do not consider the …

A lumped thermal model including thermal coupling and thermal boundary conditions for high-power IGBT modules

AS Bahman, K Ma, F Blaabjerg - IEEE Transactions on Power …, 2017 - ieeexplore.ieee.org
Detailed thermal dynamics of high-power IGBT modules are important information for the
reliability analysis and thermal design of power electronic systems. However, the existing …

New approaches to reliability assessment: Using physics-of-failure for prediction and design in power electronics systems

K Ma, H Wang, F Blaabjerg - IEEE Power Electronics Magazine, 2016 - ieeexplore.ieee.org
Power electronics are facing continuous pressure to be cheaper and smaller, have a higher
power density, and, in some cases, also operate at higher temperatures. At the same time …

Junction temperature estimation of a SiC MOSFET module for 800V high-voltage application in electric vehicles

Z Shuai, S He, Y Xue, Y Zheng, J Gai, Y Li, G Li, J Li - Etransportation, 2023 - Elsevier
Abstract Silicon Carbide (SiC) power devices have significant advantages on power density
and energy efficiency, and are widely accepted as promising solutions for future electric …

Reviewing thermal-monitoring techniques for smart power modules

S Kalker, LA Ruppert… - IEEE Journal of …, 2021 - ieeexplore.ieee.org
The increasing demand for higher power device utilization and reliability in power electronic
systems is driving the integration of condition monitoring and active control in power …

Distributed thermal modeling for power devices and modules with equivalent heat flow path extraction

X Yang, S Xu, K Heng, X Wu - IEEE Journal of Emerging and …, 2023 - ieeexplore.ieee.org
Dynamic temperature information at critical locations has been a critical indicator to safely
use power devices and modules; however, most of the existing 3-D thermal modeling …

Interleaved planar packaging method of multichip SiC power module for thermal and electrical performance improvement

F Yang, L Jia, L Wang, F Zhang, B Wang… - … on Power Electronics, 2021 - ieeexplore.ieee.org
Double-sided cooling based on planar packaging method features better thermal
performance than traditional single-sided cooling based on wire bonds. However, this …

[HTML][HTML] Thermal neural networks: Lumped-parameter thermal modeling with state-space machine learning

W Kirchgässner, O Wallscheid, J Böcker - Engineering Applications of …, 2023 - Elsevier
With electric power systems becoming more compact with higher power density, the
relevance of thermal stress and precise real-time-capable model-based thermal monitoring …