Vertically aligned carbon nanotubes arrays (VACNTs) are a promising candidate for the
thermal interface material (TIM) of next-generation electronic devices due to their attractive …

All electronic packages will induce excess heat during usage and heat dissipation methods
were developed to remove spare heat from the die in order to improve reliability. Thermal …

Thermal interface materials are crucial to minimize the thermal resistance between a
semiconductor device and a heat sink, especially for high-power electronic devices, which …

Interfaces play a critical role in heat dissipation for electronics packaging applications,
thermoelectric energy conversion, data center cooling and renewable energy systems …

This paper proposes a novel power module concept specially designed for highly reliable
silicon carbide (SiC) power devices for medium-and high-power applications. The concept …

Due to the inherently low adhesive strength and structural integrity of polymer thermal
interface materials (TIMs), they present a likely point of failure when succumbed to …

Thermal interface materials (TIMs) are extensively used in electronic devices as efficient
heat transfer materials. We fabricated all-carbon TIMs by hybridizing single-wall carbon …

Thermal greases allow a low stress bond at low bond line thicknesses (BLT) at medium
thermal conductivities and simple application, all of which make it an alternative to solders …

In this thesis, a multi-disciplinary investigation of using natural graphite sheet (NGS) for heat
sink applications is presented with focus on thermal performance, electromagnetic …

Thermal greases allow a low stress bond at low bond line thicknesses (BLT) at medium
thermal conductivities and simple application, all of which make it an alternative to solders …