Joule-heated flexible carbon composite towards the boosted electromagnetic wave shielding properties

L She, B Zhao, M Yuan, J Chen, B Fan, H Pan… - … Composites and Hybrid …, 2022 - Springer
Electromagnetic interference materials simultaneously possessing high-performance EMI
shielding and hydrophobic capability are significant in the sophisticated electronic devices. It …

Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors

H Reynes, C Buttay, H Morel - 2017 IEEE 5th Workshop on …, 2017 - ieeexplore.ieee.org
Wide bandgap semiconductors enable high voltage (10 kV and more) switches. As a
consequence, new packaging solutions are required to prepare the ground for such devices …

Combined geometrical techniques and applying nonlinear field dependent conductivity layers to address the high electric field stress issue in high voltage high …

MM Tousi, M Ghassemi - IEEE Transactions on Dielectrics and …, 2020 - ieeexplore.ieee.org
Wide bandgap (WBG) power modules made from materials such as SiC and GaN (and soon
Ga 2 O 3 and diamond), which can tolerate higher voltages and currents than Si-based …

Circuit-based electrothermal modeling of SiC power modules with nonlinear thermal models

S Race, A Philipp, M Nagel, T Ziemann… - IEEE transactions on …, 2022 - ieeexplore.ieee.org
Silicon carbide (SiC) power devices have the potential to operate at high temperatures
beyond the capabilities of silicon power devices. At increased temperatures, the temperature …

Characterization of nonlinear field-dependent conductivity layer coupled with protruding substrate to address high electric field issue within high-voltage high-density …

MM Tousi, M Ghassemi - … of Emerging and Selected Topics in …, 2019 - ieeexplore.ieee.org
In addition to higher blocking voltages of wide bandgap (WBG) power modules, their volume
has been targeted to be several times smaller than that of Si-based modules. This translates …

Development of the anodized aluminum substrates for thermoelectric energy converters

M Maksymuk, K Zazakowny, A Lis, A Kosonowski… - Ceramics …, 2023 - Elsevier
Operation of the thermoelectric converters requires hot-and cold-side insulating plates with
low thermal resistance. In this work, we developed anodized aluminum substrates with …

[图书][B] Extreme-temperature and harsh-environment electronics: physics, technology and applications

VK Khanna - 2023 - iopscience.iop.org
Electronic devices and circuits are employed by a range of industries in unfriendly
conditions, such as exposure to extreme temperatures, humidity, or radiation. This second …

Effects of laser surface modification on the adhesion strength and fracture mechanism of electroless-plated coatings

L Wu, L Meng, Y Wang, S Zhang, W Bai… - Surface and coatings …, 2022 - Elsevier
The adhesion strength between the circuit and substrate is a key factor that affects the
performance of electronics. Laser modification assisted metallization technology (LAM) …

An integrated structure–material optimization strategy for the packaging of high-voltage insulated gate bipolar transistors

L Zhong, W Liu, Y Xi, F Wang, S Chen… - … on Dielectrics and …, 2022 - ieeexplore.ieee.org
High-voltage insulated gate bipolar transistors (IGBTs), such as silicon carbide (SiC)-based
ones, are promising as wide bandgap (WBG) power modules. However, current IGBT …

Modeling of thermal integration of a catalytic microcombustor with a thermoelectric for power generation applications

N Yedala, NS Kaisare - Energy & Fuels, 2021 - ACS Publications
Power generation from coupled devices employing combustion in microreactors is
generating interest for portable or decentralized energy demands. We develop a model …