On the design of a fault-tolerant scalable three dimensional NoC-based digital neuromorphic system with on-chip learning
OM Ikechukwu, KN Dang, AB Abdallah - IEEE Access, 2021 - ieeexplore.ieee.org
Neuromorphic systems have shown improvements over the years, leveraging Spiking neural
networks (SNN) event-driven nature to demonstrate low power consumption. As …
networks (SNN) event-driven nature to demonstrate low power consumption. As …
[HTML][HTML] Toward robust cognitive 3d brain-inspired cross-paradigm system
A Ben Abdallah, KN Dang - Frontiers in Neuroscience, 2021 - frontiersin.org
Spiking Neuromorphic systems have been introduced as promising platforms for energy-
efficient spiking neural network (SNNs) execution. SNNs incorporate neuronal and synaptic …
efficient spiking neural network (SNNs) execution. SNNs incorporate neuronal and synaptic …
Smart energy management system based on reconfigurable AI chip and electrical vehicles
Almost every larger city in Europe has ambitious smart city projects. This is particularly true
for Hamburg, a Hanseatic city in the north of Germany. Hamburg is the smartest city in …
for Hamburg, a Hanseatic city in the north of Germany. Hamburg is the smartest city in …
Compact Bandpass Filters With Low Loss and TZs Based on 1/ Mode Circle-SIW in Through Silicon Vias (TSVs) Technology
C Fan, X Liu, N Liu, Z Zhu - IEEE Transactions on Microwave …, 2024 - ieeexplore.ieee.org
A range of ultracompact bandpass filters (BPFs) exploited circular-substrate-integrated
waveguide (CSIW) with low insertion loss (IL) and high selectivity are proposed based on …
waveguide (CSIW) with low insertion loss (IL) and high selectivity are proposed based on …
SREM: Smart renewable energy management scheme with distributed learning and EV network
In this article, aiming to develop the Green Internet of Vehicles (G‐IoV), we propose a smart
energy management system that leverages the intelligence edge clients and the distributed …
energy management system that leverages the intelligence edge clients and the distributed …
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit
In this work, an analytical model of strain and stress of symmetrical multilayer medium is
proposed to solve the thermal problem that occurs in silicon-core coaxial through-silicon …
proposed to solve the thermal problem that occurs in silicon-core coaxial through-silicon …
TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM
D Han, D Won, S Kim, S Kang - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
High-bandwidth memory (HBM) is one of the 3-D stacked memory standards that
demonstrate high performance, including high bandwidth, large capacity, and low power …
demonstrate high performance, including high bandwidth, large capacity, and low power …
A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems
Through-Silicon-Via (TSV) based 3D Integrated Circuits (3D-IC) are one of the most
advanced architectures by providing low power consumption, shorter wire length and …
advanced architectures by providing low power consumption, shorter wire length and …
Reflect3d: An Adaptive and Fault-Tolerant Routing Algorithm for Vertically-Partially-Connected 3D-NoC
AA Da Silva, LMES Junior, A Coelho… - 2021 34th SBC …, 2021 - ieeexplore.ieee.org
The combined benefits of the Three-Dimensional (3D) and Network-on-Chip (NoC) schemes
enable designing a high-performance system in a limited chip area. The 3D-NoC major …
enable designing a high-performance system in a limited chip area. The 3D-NoC major …
A non-blocking non-degrading multiple defects link testing method for 3D-networks-on-chip
As one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs),
Through-Silicon-Via (TSV) acts as the inter-layer link inside 3D Networks-on-Chip. However …
Through-Silicon-Via (TSV) acts as the inter-layer link inside 3D Networks-on-Chip. However …