Ultrasonic metal welding (USMW) technology receives widespread attention because of its
advantages of environmental protection, high efficiency, high welding strength, and low joint …

The purpose of this paper is to obtain the development direction for improving the reliability
of bond wires effectively in power electronics through overviewing the state-of-the-art of the …

Despite the wide and long-term applications of ultrasonic (US) wire bonding and other US
metal joining technologies, the mechanism of microweld changes during the bonding …

In the welding insulated gate bipolar transistor (IGBT) module, the module failure caused by
bonding wire failure accounts for about 70% of the total module failure. Therefore, it is …

Several methods that could effectively increase the strength of heavy aluminum bonding
wire and broaden the scope for high-power IGBT module applications with a high degree of …

In-situ transmission electron microscopy (TEM) is developed to observe the microstructure
evolution during ultrasonic bonding. It was found that many nanoparticles were generated …

The high-melting-point joints by transient-liquid-phase are increasingly playing a crucial role
in the die bonding for the high temperature electronic components. In this study, three kinds …

Ultrasonic wire bonding is a process of connecting two or more surfaces using a metal wire.
In battery manufacturing heavy wire bonding is used to connect battery cells with each other …

Currently, wire bonding is the most popular first-level interconnection technology used
between the die and package terminals, but even with its long-term and excessive usage …

Wire bonding is the most popular first-level interconnection technology used in traditional
electronic packaging but still needs fundamental research. This work investigated the …