Study of Cu film surface treatment using formic acid vapor/solution for low temperature bonding
W Yang, Y Lu, C Zhou, J Zhang… - Journal of The …, 2017 - iopscience.iop.org
In this paper, the surface of Cu film was treated with formic acid vapor and solution for Cu
low temperature bonding. After formic acid vapor/solution treatment, Cu film surface oxide …
low temperature bonding. After formic acid vapor/solution treatment, Cu film surface oxide …
A Review of Die-to-Die, Die-to-Substrate and Die-to-Wafer Heterogeneous Integration
This paper reviews advances in die/dielet-to-dielet (D2D), dielet-to-wafer (D2W) and dielet-
to-substrate integration for advanced packaging. Key D2D and D2W integration approaches …
to-substrate integration for advanced packaging. Key D2D and D2W integration approaches …
Cu film surface reduction through formic acid vapor/solution for 3-D interconnection
W Yang, C Zhou, J Zhou, Y Lu, Y Lu… - 2018 19th International …, 2018 - ieeexplore.ieee.org
Copper has been was widely applied on packaging technique because of the high
conductivity, high thermal conduction index and low cost. It is hard to make Cu-Cu direct …
conductivity, high thermal conduction index and low cost. It is hard to make Cu-Cu direct …
A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects
Recently, Cu interconnect and low-k materials have been applied to reduce the interconnect
resistive-capacitive delay issue. However, as the process node size is reduced to a few …
resistive-capacitive delay issue. However, as the process node size is reduced to a few …
Formic acid with Pt catalyst combined treatment process for Cu low temperature bonding
W Yang, M Akaike, M Fujino… - 2012 13th International …, 2012 - ieeexplore.ieee.org
In this study, formic acid combined Pt catalyst in situ pretreatment process was developed for
low temperature Cu/Cu direct bonding. Cu film surface was treated by formic acid …
low temperature Cu/Cu direct bonding. Cu film surface was treated by formic acid …