Thermal management of computer hardware modules
HU Yuanchen, S Iruvanti, PKB Rego - US Patent App. 17/849,679, 2023 - Google Patents
2022-06-26 Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION
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Integrated circuit package with surface modified liquid metal spheres and method of making
M Mayukh, SP Tendel, S Karikalan… - US Patent App. 17 …, 2023 - Google Patents
2021-07-30 Assigned to AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
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reassignment AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED …