An organic additive, Diazine Black (DB), was employed as a leveler for microvia filling using
copper electroplating. DB is a derivative of Janus Green B (JGB), which is a common leveler …

Janus Green B (JGB) and Safranine T (ST) were used as levelers in the through-hole (TH)
copper electroplating experiments. Although JGB and ST have a similar part in the structure …

The coupling of surface shape dynamics and surface composition for a material growing by
electrodeposition has been found in recent modelling work by the authors, to give rise to a …

A series of DPP derivatives bearing quaternary ammonium salt centers with different lengths
of carbon chains have been designed and synthesized. Their inhibition actions on copper …

Shortening the Cu gap-filling time at microvias by electrodeposition is critical for increasing
the productivity of printed circuit board (PCB) fabrication. Additives that can facilitate …

In this work, microvia filling was performed by copper electroplating using two plating
formulas with and without a leveler at a low concentration of chloride. The base plating …

A family of branched quaternary ammonium surfactants (compounds 1a–1c) with different
carbon chains were synthesized for levelers applied in copper electroplating. Their inhibitory …

Secondary Zn–based batteries are a valid alternative to Li for stationary storage, but
commercial devices are not yet available, chiefly owing to anode shape‐change and …

Through-glass vias (TGVs) have been extensively researched due to the unique properties
of glass, including low dielectric constant, high transparency, high mechanical, thermal and …

Cerium oxide nanoparticles and nanoporous thin films exhibiting room temperature
magnetism have been synthesized by two different methods. The magnetization curves for …