Preparation and properties of copper-plated expanded graphite/copper composites
L Bai, Y Ge, L Zhu, Y Chen, M Yi - Tribology International, 2021 - Elsevier
The porous expanded graphite (EG) was metallized by electroless plating to improve the C‒
Cu interface bonding, and the copper-plated EG/Cu (EG@ Cu/Cu) composites with different …
Cu interface bonding, and the copper-plated EG/Cu (EG@ Cu/Cu) composites with different …
The influence of interface structure on the microstructure and properties of Cu/graphite joint prepared by vacuum diffusion bonding
Y Wei, Y Chen, B Guo, L Zhu - Vacuum, 2023 - Elsevier
The hybrid structure of copper and graphite has important applications in plasma-oriented
components and automobile commutators. In view of the poor wettability of copper to …
components and automobile commutators. In view of the poor wettability of copper to …
On the role of the plaque porous structure in mussel adhesion: implications for adhesion control using bulk patterning
Mussel adhesion is a problem of great interest to scientists and engineers. Recent
microscopic imaging suggests that the mussel material is porous with patterned void …
microscopic imaging suggests that the mussel material is porous with patterned void …
Extreme enhancement of interfacial adhesion by bulk patterning of sacrificial cuts
Many biological materials, such as bone and nacre, gain their strength and toughness
through the formation of sacrificial bonds and hidden length structures. Here, inspired by …
through the formation of sacrificial bonds and hidden length structures. Here, inspired by …