A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints

N Ismail, A Atiqah, A Jalar, MA Bakar… - Journal of Manufacturing …, 2022 - Elsevier
This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …

Effect of alloy particle size and stencil aperture shape on solder printing quality

MS Mohamed Sunar, M Abu Bakar, A Jalar… - Microelectronics …, 2022 - emerald.com
Purpose Reflow solder joint quality is significantly affected by the ability of the solder to
perfectly fill pad space and retain good solder joint shape. This study aims to investigate …

Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars

S Wakeel, A Haseeb, KL Hoon… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
In this work, two commercial no clean fluxes, namely, extremely low residue no-clean flux
(NCF)(NC-1) and ordinary NCF (NC-2), were used for the preparation of a fine pitch flip-chip …

Comparative study of tripropylamine and naphthylamine as additives in wave solder flux: investigation of solderability and corrosion effects

F Li, MS Jellesen, R Ambat - Journal of Materials Science: Materials in …, 2022 - Springer
Dicarboxylic acid flux activators are used in no-clean wave solder flux formulation for
activating the solder surfaces on Printed Board Assembly (PBA) during the soldering …

Characterization and Analysis of High Efficiency Aqueous-Based Flux Cleaning Process for High Voltage Power Device Packages

V Ramalingam, LS Morales - 2023 IEEE 25th Electronics …, 2023 - ieeexplore.ieee.org
In the world of power electronics, products with a large die-to-package ratio are sought-after
since customers receive the maximum product performance within the package rating. The …