During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

With the miniaturization of solder joints and deterioration of serving environment, much effort
had been taken to improve the properties of Sn‐based lead‐free solders. And the fabrication …

In order to satisfy the needs of electronic industries for high-reliability joints, different kinds of
nanoparticles were incorporated into conventional Pb-free solders to enhance the …

Sn is the main interconnect material for three-dimensional (3D) Packaging of chip stacking
in electronic packaging. In this paper, the intermetallic compound (IMC) produced through …

The continuous miniaturization of electronic products and the constantly rising functionality
demand by final users necessitate major challenges for the academia and the industry to …

To fabricate electrodes for use in flexible electronic devices with improved resistance to the
mechanical stresses induced by repeated bending, we developed a highly flexible and …

InSn-50Ag composite solder joints doping Ni-coated carbon nanotubes (Ni-CNTs) were
fabricated by transient liquid phase (TLP) bonding, and then the effect of Ni-CNTs contents …

Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced
soldering. They have excellent mechanical, electrical, and thermal properties and are …

Abstract The Sn58Bi solder has gained significant attention in the electronic packaging
industry owing to its low melting temperature and excellent mechanical properties. However …

To accomplish a high-speed bonding process of dies for the formation of a bondline with
mechanical reliability at high temperatures and excellent thermal conductance, pressure …