Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview

BL Rakshith, LG Asirvatham, AA Angeline… - … and Sustainable Energy …, 2022 - Elsevier
Thermal ground planes (TGPs) are considered to be one the most promising thermal
management devices for cooling the high heat flux miniaturized power electronic devices …

Significant factors affecting heat transfer performance of vapor chamber and strategies to promote it: A critical review

D Xie, Y Sun, G Wang, S Chen, G Ding - … Journal of Heat and Mass Transfer, 2021 - Elsevier
The increasing heat flux of electronic systems, caused by the miniaturization and high
integration, has posed a huge challenge to efficient and effective thermal management …

High-performance electrodeposited copper wicks for heat-spreading vapor chambers

JC Yu, HC Chien, CY Chiang, EC Liu… - Applied Thermal …, 2023 - Elsevier
A capillary wick structure is a key component for producing the capillary pressure that drives
two-phase circulation in phase-change heat transfer devices such as heat pipes and vapor …

Advanced aramid fibrous materials: fundamentals, advances, and beyond

A He, T Xing, Z Liang, Y Luo, Y Zhang, M Wang… - Advanced Fiber …, 2024 - Springer
Aramid fibers (AFs) are widely applied in many cutting-edge fields, due to their excellent
comprehensive performance. Ongoing research efforts are therefore underway to expand …

Model for estimating power dissipation along the interconnect length in single on-chip topology

D Gura, A Mikhaylov, S Glushkov, M Zaikov… - Evolutionary …, 2020 - Springer
Designing a typical microcircuit for multi-core chips includes the development of the overall
system architecture as well as the creation of single-chip multiprocessor systems, which …

Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED

L Chen, D Deng, Q Huang, X Xu, Y Xie - Applied Thermal Engineering, 2020 - Elsevier
This study developed a vapor chamber (VC) with radial multi-artery reentrant microchannels
for thermal management of high-power light emitting diodes (LEDs). It featured Ω-shaped …

A review of direct drive proportional electrohydraulic spool valves: industrial state-of-the-art and research advancements

P Tamburrano, AR Plummer… - Journal of …, 2019 - asmedigitalcollection.asme.org
This paper reviews the state of the art of directly driven proportional directional hydraulic
spool valves, which are widely used hydraulic components in the industrial and …

[HTML][HTML] Polyethersulfone wick and metal wick based loop heat pipe for LED street light thermal management

X Hu, C Hu, H Xu, Y He, D Tang - Case Studies in Thermal Engineering, 2023 - Elsevier
The challenge of dissipating heat from light-emitting diode (LED) poses a limitation on LED's
application. Loop heat pipe (LHP) is an efficient heat transfer device that is used in the …

Performance investigation of radial heat sink with circular base and perforated staggered fins

S Sundar, G Song, MZ Zahir, JS Jayakumar… - International Journal of …, 2019 - Elsevier
A radial heat sink with circular base and perforated short fins arranged in staggered manner,
proposed for LED light bulbs was investigated under natural convection and radiation heat …

Experimental investigation of a vapour chamber heat spreader with hybrid wick structure

J Velardo, A Date, R Singh, J Nihill, A Date… - International journal of …, 2019 - Elsevier
The vapour chamber is a two-phase heat transfer device that is able to effectively spread
heat from concentrated heat sources to much larger heat sinks. This paper presents an …