A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
HK Kannojia, P Dixit - Journal of Materials Science: Materials in …, 2021 - Springer
Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
Reprint of: Nanocalorimetry: Door opened for in situ material characterization under extreme non-equilibrium conditions
The past two decades have witnessed the rapid development of nanocalorimetry, a novel
materials characterization technique that employs micromachined calorimetric sensors. The …
materials characterization technique that employs micromachined calorimetric sensors. The …
[HTML][HTML] Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …
however, the factors affecting their nucleation and morphology are not well understood …
Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations
The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the
performance of solder joints in an electronic package. Recently, Indium (In) has attracted …
performance of solder joints in an electronic package. Recently, Indium (In) has attracted …
[HTML][HTML] The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7 Cu-0.05 Ni alloys for high strength soldering
This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …
interconnections is a key thermophysical property that is required for microstructure-level …
[HTML][HTML] Microstructure and porosity evolution of alkali activated slag at various heating temperatures
This paper elucidated the microstructural and porosity evolution of alkali activated slag at
800° C up to 1200° C. The microstructural analysis obtained shows the changes in surface …
800° C up to 1200° C. The microstructural analysis obtained shows the changes in surface …
Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging
C Li, S Chen, S Cai, J Peng, X Wang… - Journal of Iron and Steel …, 2023 - Springer
The effects of Mn addition (0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) on microstructure, shear
mechanical behavior, and interfacial thermal stabilities of SAC305 joints were investigated …
mechanical behavior, and interfacial thermal stabilities of SAC305 joints were investigated …
Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain
Cu 6 Sn 5 is an important intermetallic for electric interconnects and anode material of Li-ion
batteries, with a polymorphic transformation from hexagonal eta-Cu 6 Sn 5 at temperatures …
batteries, with a polymorphic transformation from hexagonal eta-Cu 6 Sn 5 at temperatures …
Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni
The influence of Ni on the size and twinning of primary Cu 6 Sn 5 crystals in Sn-0.7 Cu-0.05
Ni and Sn-xCu (x= 0.7, 0.9, 1.1)(mass%) solder joints is studied using synchrotron …
Ni and Sn-xCu (x= 0.7, 0.9, 1.1)(mass%) solder joints is studied using synchrotron …