Chemical mechanical polishing slurry of copper usually contains more than four
compositions, in which strong acids, alkalis or hazardous chemicals are normally employed …

Studies on the development of modern methods of precision surface polishing for the
production of electronic device and optical system elements from glass and optical and …

The grinding process via friction at the micro-scale in a mill with stones is considered a
variable combination of contacts, with two-body (the asperities of lower millstone in direct …

Chemical mechanical planarization (CMP) of metal components is an essential step in the
fabrication of integrated circuits. Metal CMP is a complex process where strategically …

The wear phenomenon of a dental milling cutter is studied based on experimental results
and data and validated by statistical–mathematical modeling. The results of the statistical …

The goal of chemical mechanical polishing (CMP) is to achieve a flat and smooth surface for
through silicon via (TSV) application. In order to obtain high efficiency and high quality …

This study investigates the effect of chemical mechanical planarization (CMP) processing
parameters such as platen velocity, the concentration of the oxidizer and abrasive …

Розглянуто роботи по створенню сучасних методів полірування прецизійних поверхонь
елементів електронної техніки та оптичних систем зі скла, оптичних і …

The effect of slurry abrasive nanoparticle (NP) concentration on the tribological, thermal and
kinetic attributes of tungsten chemical mechanical planarization (CMP) was investigated …

Following up our earlier work that highlighted the relationship between shear force (SF) and
platen motor current (PMC), in parallel with the relationship between coefficient of friction …